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ON FDG6316P
MOSFET P-Ch PowerTrench Specified 1.8V
Brands: ON Semiconductor, LLC
Mfr.Part #: FDG6316P
Datasheet: FDG6316P Datasheet (PDF)
Package/Case: SC-70-6
Product Type: Transistors
FDG6316P General Description
This P-channel 1.8V specified MOSFET uses an advanced low voltage PowerTrench® process. It has been optimized for battery power management applications.
Features
- -0.7 A, -12 V
- RDS(ON) = 270 mΩ @ VGS = -4.5 V
- RDS(ON) = 360 mΩ @ VGS = -2.5 V
- RDS(ON) = 650 mΩ @ VGS = -1.8 V
- Low Gate Charge
- High-Performance Trench Technology for Extremelylow RDS(ON)
- Compact industry standard SC70-6 surface mountpackage
Application
- This product is general usage and suitable for many different applications.
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Source Content uid | FDG6316P | Pbfree Code | Yes |
| Part Life Cycle Code | Active | Ihs Manufacturer | ONSEMI |
| Package Description | SC-70, 6 PIN | Manufacturer Package Code | 419B-02 |
| Reach Compliance Code | compliant | ECCN Code | EAR99 |
| Samacsys Manufacturer | onsemi | Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE |
| DS Breakdown Voltage-Min | 12 V | Drain Current-Max (ID) | 0.7 A |
| Drain-source On Resistance-Max | 0.27 Ω | FET Technology | METAL-OXIDE SEMICONDUCTOR |
| JESD-30 Code | R-PDSO-G6 | JESD-609 Code | e3 |
| Moisture Sensitivity Level | 1 | Number of Elements | 2 |
| Number of Terminals | 6 | Operating Mode | ENHANCEMENT MODE |
| Operating Temperature-Max | 150 °C | Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR | Package Style | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | Polarity/Channel Type | P-CHANNEL |
| Power Dissipation-Max (Abs) | 0.3 W | Qualification Status | Not Qualified |
| Surface Mount | YES | Terminal Finish | Matte Tin (Sn) - annealed |
| Terminal Form | GULL WING | Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | Transistor Application | SWITCHING |
| Transistor Element Material | SILICON | Pin Count | 6 |
| Package Category | SOT23 (6-Pin) | Released Date | Apr 13, 2015 |
| Last Modified Date | Mar 7, 2023 4:10 PM UTC |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The FDG6316P chip is a power MOSFET designed for high-speed switching applications. It features low on-resistance and low gate charge, enabling efficient power management and reduced power losses. The chip is commonly used in various electronic devices, such as power supplies, motor drives, and lighting applications.
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Pinout
The FDG6316P is a P-channel power MOSFET with a pin count of 6. Its main function is to control the flow of current in a circuit as a switch or amplifier. -
Application Field
The FDG6316P is a power MOSFET commonly used in various electronic applications such as power supplies, motor control, and automotive systems. It is suitable for high-current switching operations due to its low on-resistance and fast switching characteristics. -
Package
The package type of the FDG6316P chip is SOT-23. The chip has a form factor of surface mount with three leads. The size of the chip is approximately 2.9mm x 1.3mm.
Datasheet PDF
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