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Intel EP4CGX30CF23C8N

FPGA Cyclone® IV GX Family 29440 Cells 60nm Technology 1.2V 484-Pin FBGA Tray

ISO14001 ISO9001 DUNS

Brands: Intel Corp

Mfr.Part #: EP4CGX30CF23C8N

Datasheet: EP4CGX30CF23C8N Datasheet (PDF)

Package/Case: BGA484

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2683 pcs, New Original

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Quick Quote

Please submit RFQ for EP4CGX30CF23C8N or email to us: Email: [email protected], we will contact you within 12 hours.

EP4CGX30CF23C8N General Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 290 1105920 29440 484-BGA

EP4CGX30CF23C8N
Intel Corp Inventory

Specifications

Parameter Value Parameter Value
feature-family-name Cyclone® IV GX feature-process-technology 60nm
feature-maximum-number-of-user-i-os 290 feature-number-of-registers
feature-device-logic-cells 29440 feature-device-system-gates
feature-number-of-multipliers 80 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 1080 feature-total-number-of-block-ram 120
feature-ethernet-macs feature-supported-ip-core Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|Sub-frame Latency JPEG 2000 Encoder (BA130)|PCI Express to AXI Bridge Controller (GPEX-PAB)|ISA/PC Card/PCMCIA/Compact Flash Host Adapter
feature-supported-ip-core-manufacture Altera/CAST, Inc/Barco Silex/Mobiveil, Inc/Eureka Technology Inc feature-maximum-number-of-serdes-channels
feature-device-logic-units 29440 feature-device-number-of-dlls-plls 2
feature-transceiver-blocks 4 feature-transceiver-speed-gbps 3.125
feature-dedicated-dsp feature-pci-blocks 1
feature-programmability Yes feature-maximum-internal-frequency-mhz
feature-speed-grade 8 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL feature-single-ended-i-o-standards-supported LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL
feature-external-memory-interface DDR2 SDRAM|QDRII+SRAM feature-minimum-operating-supply-voltage-v 1.16
feature-maximum-operating-supply-voltage-v 1.24 feature-packaging Tray
feature-rohs feature-rad-hard
feature-pin-count 484 feature-supplier-package FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A991
feature-svhc No

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP4CGX30CF23C8N is a high-performance programmable logic device (PLD) manufactured by Intel (formerly Altera). It belongs to the Cyclone IV GX family and offers 30,000 logic elements, 306 user I/Os, and 23,136 Kbits of embedded memory. The chip is ideal for applications requiring high-speed processing, low power consumption, and high levels of integration.
  • Equivalent

    The equivalent products of EP4CGX30CF23C8N chip are EP4CE30F23C8N, EP4CFA30C7N, EP4CFA30C6N, EP4CGX30CF23I7N, EP4CE30F23I7N, EP4CGX30CF23I8N. These chips belong to the Cyclone IV FPGA family by Intel (Altera). They have similar features and specifications to the EP4CGX30CF23C8N chip.
  • Features

    EP4CGX30CF23C8N is a low-cost, low-power CPLD in a 144-pin FineLine BGA package. It features 30208 logic elements, 476 Kbits of RAM, 149 embedded 18 x 18 multipliers, and up to 240 user I/O pins. It operates at a maximum of 275 MHz and has on-chip oscillator and PLL.
  • Pinout

    The EP4CGX30CF23C8N is a 624-pin FPGA with 292 user I/Os, 3.3V supply voltage, and 830 MHz maximum operating frequency. It contains 30,000 logic elements and 1,152 Kbits of RAM. It can be reprogrammed to perform a wide variety of functions such as data processing, signal processing, and control applications.
  • Manufacturer

    The EP4CGX30CF23C8N is manufactured by Intel. Intel is an American multinational corporation that produces computer processors, motherboards, and other electronics components. It is one of the largest semiconductor chip manufacturers in the world and is known for its dominance in the computing industry.
  • Application Field

    The EP4CGX30CF23C8N is commonly used in industrial automation, telecommunications, automotive, and consumer electronics applications. It is suitable for a wide range of functions including data processing, image and signal processing, and control system design. Its small size and low power consumption make it ideal for embedded systems and portable devices.
  • Package

    The EP4CGX30CF23C8N chip comes in a Ball Grid Array (BGA) package type, with a form factor of 672-balls. It has a size of 17mm x 17mm and is designed for use in advanced FPGA designs requiring high performance capabilities.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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