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Intel EP4CGX150DF27I7N

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 393 6635520 149760 672-BGA

ISO14001 ISO9001 DUNS

Brands: Intel Corp

Mfr.Part #: EP4CGX150DF27I7N

Datasheet: EP4CGX150DF27I7N Datasheet (PDF)

Package/Case: FBGA-672

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3878 pcs, New Original

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EP4CGX150DF27I7N General Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 393 6635520 149760 672-BGA

ep4cgx150df27i7n
ep4cgx150df27i7n
ep4cgx150df27i7n

Specifications

Parameter Value Parameter Value
Pin Count 672 Package Category BGA
Released Date Aug 23, 2022

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP4CGX150DF27I7N chip is a high-capacity and high-performance field-programmable gate array (FPGA) that offers advanced capabilities for digital circuit design and implementation. It is manufactured by Intel (formerly Altera) and features 150,000 logic elements, 5,583 kilobits of embedded memory, and various I/O interfaces. The chip provides flexibility and versatility for a wide range of applications, including telecommunications, industrial automation, and video processing.
  • Features

    The EP4CGX150DF27I7N is a member of the Cyclone IV GX FPGA family. It features a maximum number of logic elements of 150,000, a package size of 27x27mm, and operates at a voltage of 1.0 V to 1.2 V. It also supports various communication protocols such as PCIe, Gigabit Ethernet, and USB.
  • Pinout

    The EP4CGX150DF27I7N is a Field-Programmable Gate Array (FPGA) with a pin count of 780. It has various pins with different functions, including I/O pins for input and output signals, power and ground pins for power supply, configuration pins for device programming, and clock pins for clock signals.
  • Manufacturer

    The manufacturer of the EP4CGX150DF27I7N is Intel Corporation. It is an American multinational corporation that designs and manufactures semiconductor chips, including programmable logic devices like the EP4CGX150DF27I7N. Intel is primarily known for its central processing units (CPUs) but also produces a wide range of other semiconductor products for various industries.
  • Application Field

    The EP4CGX150DF27I7N is a field-programmable gate array (FPGA) that can be used in various application areas such as telecommunications, automotive, aerospace, industrial automation, and medical devices. It offers high-performance processing capabilities, programmability, and flexibility to meet the requirements of diverse applications.
  • Package

    The EP4CGX150DF27I7N chip has a FineLine BGA (FBGA) package type. It has a 27 x 27 mm form factor and a size of 484 balls.

Datasheet PDF

Preliminary Specification EP4CGX150DF27I7N PDF Download

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