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Intel EP4CE30F23C7N

FPGA Cyclone® IV E Family 28848 Cells 60nm Technology 1.2V 484-Pin FBGA

ISO14001 ISO9001 DUNS

Brands: Intel Corp

Mfr.Part #: EP4CE30F23C7N

Datasheet: EP4CE30F23C7N Datasheet (PDF)

Package/Case: FBGA-484

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2165 pcs, New Original

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Please submit RFQ for EP4CE30F23C7N or email to us: Email: [email protected], we will contact you within 12 hours.

EP4CE30F23C7N General Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 328 608256 28848 484-BGA

Intel Corp Inventory

Specifications

Parameter Value Parameter Value
feature-family-name Cyclone® IV E feature-process-technology 60nm
feature-maximum-number-of-user-i-os 328 feature-number-of-registers
feature-device-logic-cells 28848 feature-device-system-gates
feature-number-of-multipliers 66 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 594 feature-total-number-of-block-ram 66
feature-ethernet-macs feature-supported-ip-core Sub-frame Latency JPEG 2000 Encoder (BA130)|RapidIO to AXI Bridge Controller (RAB)|EtherCAT|EtherNET/IP|DS1/E1 TDM over Packet IP core
feature-supported-ip-core-manufacture Barco Silex/Mobiveil, Inc/Beckhoff Automation GmbH/Softing AG/Aimvalley feature-maximum-number-of-serdes-channels
feature-device-logic-units 28848 feature-device-number-of-dlls-plls 4
feature-transceiver-blocks feature-transceiver-speed-gbps
feature-dedicated-dsp 66 feature-pci-blocks 1
feature-programmability Yes feature-maximum-internal-frequency-mhz
feature-speed-grade 7 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL feature-single-ended-i-o-standards-supported LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL
feature-external-memory-interface DDR SDRAM|DDR2 SDRAM|QDRII+SRAM feature-minimum-operating-supply-voltage-v 1.15
feature-maximum-operating-supply-voltage-v 1.25 feature-packaging
feature-rohs feature-rad-hard
feature-pin-count 484 feature-supplier-package FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A991
feature-svhc No

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP4CE30F23C7N is a 30k logic element FPGA (Field Programmable Gate Array) chip from Intel (formerly Altera). It features 23,350 logic elements, 504 embedded memory blocks, and 324 multipliers. This chip is commonly used in a variety of applications including digital signal processing, industrial automation, and communications.
  • Equivalent

    Some equivalent products of the EP4CE30F23C7N chip are EP4CE30F23I7N, EP4CE30F23A7N, EP4CE30F23I8N, and EP4CE30F23I6N. These chips are part of the same family of Altera Cyclone IV FPGAs and offer similar functionality and features.
  • Features

    EP4CE30F23C7N is an Altera Cyclone IV FPGA with 29,440 Logic Elements, 36 Embedded Multipliers, 281 Kb Embedded Memory, 475 Maximum User I/Os, 346 Maximum User I/Os, and a maximum operating frequency of 423 MHz. It also features JTAG, SPI, and I2C programmability interfaces.
  • Pinout

    The EP4CE30F23C7N is a Field Programmable Gate Array (FPGA) with 484 pins. It features 30,048 logic elements, 600 Kbits of RAM, and 336 multipliers. It is commonly used in high-performance applications such as networking, telecommunications, and industrial automation.
  • Manufacturer

    The EP4CE30F23C7N is manufactured by Intel Corporation, a multinational technology company that produces semiconductors and various other computing components. Intel is known for its processors and FPGAs that are used in a wide range of electronic devices such as computers, laptops, and servers.
  • Application Field

    The EP4CE30F23C7N is commonly used in a variety of applications including telecommunications, automotive, industrial automation, and consumer electronics. It is suitable for tasks such as signal processing, data processing, image and video processing, and control systems due to its flexibility and performance capabilities.
  • Package

    The EP4CE30F23C7N chip comes in a plastic flip-chip ball grid array (FCBGA) package. It has a 780-pin design with a package size of 23x23 mm. The chip is in a form of an integrated circuit and size of the chip is 144 mm2.

Datasheet PDF

Preliminary Specification EP4CE30F23C7N PDF Download

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  • quantity

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