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Intel EP4CE75F29I7N
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 426 2810880 75408 780-BGA
Brands: Intel Corp
Mfr.Part #: EP4CE75F29I7N
Datasheet: EP4CE75F29I7N Datasheet (PDF)
Package/Case: FBGA-780
Product Type: Programmable Logic ICs
EP4CE75F29I7N General Description
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 426 2810880 75408 780-BGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pin Count | 780 | Package Category | BGA |
| Released Date | Dec 8, 2020 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The EP4CE75F29I7N is a field-programmable gate array (FPGA) chip from Altera (now Intel) that offers high performance and flexibility in digital circuit design. It features 75,000 logic elements, 52,352 adaptive logic modules, and 1,280 Kbits of embedded memory. This chip is commonly used in applications like telecommunications, industrial automation, and embedded systems.
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Equivalent
Some equivalent products for the EP4CE75F29I7N chip include Altera Cyclone IV EP4CE75F29C8N, EP4CE75F17C8 and EP4CE75U19I7N. These chips are similar in terms of capabilities and features, providing options for users looking for alternatives to the EP4CE75F29I7N. -
Features
Some features of EP4CE75F29I7N include: 74,880 Logic Elements, 4,320 Kbits embedded memory, 456 18x18 multipliers, 6 phase-locked loops, 528 user I/Os, and up to 300 MHz core speed. It also has support for high-speed transceivers, advanced DSP blocks, and embedded configuration memory. -
Pinout
The EP4CE75F29I7N is a FPGA with a pin count of 780. It offers 75,000 logic elements, 708 user I/Os, and 4 Gbits of embedded memory. It also includes functions such as digital signal processing, high-speed I/O, and embedded memory. -
Manufacturer
The EP4CE75F29I7N is manufactured by Intel Corporation. Intel Corporation is an American multinational corporation and technology company that specializes in semiconductor chips. They are one of the largest and most well-known manufacturers of computer hardware and electronic components in the world. -
Application Field
The EP4CE75F29I7N, a member of the Cyclone IV E family of FPGA devices, is commonly used in various applications such as automotive, industrial automation, communications, and consumer electronics. Its features including high performance, low power consumption, and a range of interfaces make it suitable for a wide range of embedded design projects. -
Package
The EP4CE75F29I7N chip has a BGA (Ball Grid Array) package type, with a Form Factor of 29 x 29 mm. The package size is 780-ball.
Datasheet PDF
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