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Intel EP4CE40F29I7N

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 532 1161216 39600 780-BGA

ISO14001 ISO9001 DUNS

Brands: Intel Corp

Mfr.Part #: EP4CE40F29I7N

Datasheet: EP4CE40F29I7N Datasheet (PDF)

Package/Case: FBGA-780

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3980 pcs, New Original

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EP4CE40F29I7N General Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 532 1161216 39600 780-BGA

ep4ce40f29i7n
Intel Corp Inventory

Specifications

Parameter Value Parameter Value
Pin Count 780 Package Category BGA
Released Date Apr 21, 2017

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP4CE40F29I7N chip is a Field-Programmable Gate Array (FPGA) manufactured by Altera (now Intel FPGA). It offers 39,600 logic elements, 1,620 Kbits of memory, and 294 embedded multipliers, making it suitable for designing and implementing complex digital circuits. It operates on a 1.2V core voltage and offers various I/O interfaces, making it highly versatile for different applications.
  • Equivalent

    Some equivalent products of the EP4CE40F29I7N chip include EP4CE10F17C8N and EP4CE15F17C8N.
  • Features

    The EP4CE40F29I7N is a field-programmable gate array (FPGA) from Altera, now part of Intel. It has a capacity of 39,600 logic elements, 29,520 adaptive logic modules, and 504 embedded memory blocks. It operates with a core voltage of 1.0V and supports 3.125 Gbps transceiver data rate, making it suitable for a wide range of applications.
  • Pinout

    The EP4CE40F29I7N is an FPGA with a pin count of 780. Its main functions include providing programmable logic and configurable input/output interfaces for various applications.
  • Manufacturer

    The manufacturer of the EP4CE40F29I7N is Intel Corporation. Intel is an American multinational technology company that designs and manufactures a range of semiconductors, processors, and other computer-related products. Additionally, it offers various solutions in cloud computing, artificial intelligence, and Internet of Things (IoT) technologies.
  • Application Field

    The EP4CE40F29I7N is an FPGA (Field-Programmable Gate Array) suitable for a variety of applications including industrial automation, video and image processing, communications, and embedded systems. It offers a high level of flexibility and can be programmed to perform specific tasks in various industries requiring real-time processing capabilities.
  • Package

    The EP4CE40F29I7N chip comes in a BGA (Ball Grid Array) package type, which is a surface mount technology. Its form is integrated circuit (IC) and it has a size of 29mm x 29mm.

Datasheet PDF

Preliminary Specification EP4CE40F29I7N PDF Download

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