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Intel EP4CE40F23C7N

FPGA Cyclone® IV E Family 39600 Cells 60nm Technology 1.2V 484-Pin FBGA

ISO14001 ISO9001 DUNS

Brands: Intel Corp

Mfr.Part #: EP4CE40F23C7N

Datasheet: EP4CE40F23C7N Datasheet (PDF)

Package/Case: FBGA-484

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3839 pcs, New Original

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Quick Quote

Please submit RFQ for EP4CE40F23C7N or email to us: Email: [email protected], we will contact you within 12 hours.

EP4CE40F23C7N General Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 328 1161216 39600 484-BGA

ep4ce40f23c7n
ep4ce40f23c7n
Intel Corp Inventory

Specifications

Parameter Value Parameter Value
feature-family-name Cyclone® IV E feature-process-technology 60nm
feature-maximum-number-of-user-i-os 328 feature-number-of-registers
feature-device-logic-cells 39600 feature-device-system-gates
feature-number-of-multipliers 116 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 1134 feature-total-number-of-block-ram 126
feature-ethernet-macs feature-supported-ip-core Sub-frame Latency JPEG 2000 Encoder (BA130)|RapidIO to AXI Bridge Controller (RAB)|EtherCAT|EtherNET/IP|DS1/E1 TDM over Packet IP core
feature-supported-ip-core-manufacture Barco Silex/Mobiveil, Inc/Beckhoff Automation GmbH/Softing AG/Aimvalley feature-maximum-number-of-serdes-channels
feature-device-logic-units 39600 feature-device-number-of-dlls-plls 4
feature-transceiver-blocks feature-transceiver-speed-gbps
feature-dedicated-dsp feature-pci-blocks
feature-programmability Yes feature-maximum-internal-frequency-mhz
feature-speed-grade 7 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL feature-single-ended-i-o-standards-supported LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL
feature-external-memory-interface DDR SDRAM|DDR2 SDRAM|QDRII+SRAM feature-minimum-operating-supply-voltage-v 1.15
feature-maximum-operating-supply-voltage-v 1.25 feature-packaging
feature-rohs feature-rad-hard
feature-pin-count 484 feature-supplier-package FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A991
feature-svhc No

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • EP4CE40F23C7N is an integrated circuit chip, specifically a field-programmable gate array (FPGA). It is manufactured by Altera, now owned by Intel. This chip is commonly used in various electronic devices and applications. It offers a range of features and capabilities, including reprogrammable logic blocks, high-speed I/O interfaces, embedded memory, and configuration via serial interface.
  • Equivalent

    Some equivalent products of EP4CE40F23C7N chip are EP4CE40F29C8N, EP4CE40F29I7N, and EP4CE40F29C7N.
  • Features

    EP4CE40F23C7N is a Cyclone IV FPGA with 39,600 logic elements, 162 embedded 18x18 multipliers, 4 fractional PLLs, and 291 on-chip memory blocks. It operates at a maximum frequency of 475MHz and is built on a 40nm process. It supports various interfaces such as LVDS, PCI Express, and DDR3 memory.
  • Pinout

    The EP4CE40F23C7N is a Field Programmable Gate Array (FPGA) with a pin count of 484, meaning it has 484 external pins for connecting to external devices or circuits. Its function is to perform data processing and control tasks in electronic systems, and it can be programmed or configured to perform various functions based on the specific application requirements.
  • Manufacturer

    The manufacturer of the EP4CE40F23C7N is Intel. Intel is a multinational technology company that specializes in the design and manufacturing of semiconductors, including programmable logic devices like the EP4CE40F23C7N. They are known for their advancements in microprocessor technology and have a wide range of products and services in the field of computer and communication devices.
  • Application Field

    The EP4CE40F23C7N FPGA can be used in various application areas such as telecommunications, industrial automation, automotive, medical equipment, and aerospace. It offers high performance and versatility, making it suitable for a wide range of applications that require programmable logic for data processing, control systems, signal processing, and more.
  • Package

    The EP4CE40F23C7N chip has a package type of FBGA (Fine-Pitch Ball Grid Array), a form factor of 23mm x 23mm, and a package size of 484 balls.

Datasheet PDF

Preliminary Specification EP4CE40F23C7N PDF Download

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  • Product

    We have rich products, can meet your various needs.

  • quantity

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  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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