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Altera EP4CE15F23C6N

FPGA Cyclone® IV E Family 15408 Cells 60nm Technology 1.2V 484-Pin FBGA

ISO14001 ISO9001 DUNS

Brands: Altera Corporation (Intel)

Mfr.Part #: EP4CE15F23C6N

Datasheet: EP4CE15F23C6N Datasheet (PDF)

Package/Case: FBGA-484

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3807 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for EP4CE15F23C6N or email to us: Email: [email protected], we will contact you within 12 hours.

EP4CE15F23C6N General Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 343 516096 15408 484-BGA

Altera Corporation (Intel) Inventory

Specifications

Parameter Value Parameter Value
feature-family-name Cyclone® IV E feature-process-technology 60nm
feature-maximum-number-of-user-i-os 343 feature-number-of-registers
feature-device-logic-cells 15408 feature-device-system-gates
feature-number-of-multipliers 56 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 504 feature-total-number-of-block-ram 56
feature-ethernet-macs feature-supported-ip-core Sub-frame Latency JPEG 2000 Encoder (BA130)|RapidIO to AXI Bridge Controller (RAB)|EtherCAT|EtherNET/IP|DS1/E1 TDM over Packet IP core
feature-supported-ip-core-manufacture Barco Silex/Mobiveil, Inc/Beckhoff Automation GmbH/Softing AG/Aimvalley feature-maximum-number-of-serdes-channels
feature-device-logic-units 15408 feature-device-number-of-dlls-plls 4
feature-transceiver-blocks feature-transceiver-speed-gbps
feature-dedicated-dsp feature-pci-blocks
feature-programmability Yes feature-maximum-internal-frequency-mhz
feature-speed-grade 6 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL feature-single-ended-i-o-standards-supported LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL
feature-external-memory-interface DDR SDRAM|DDR2 SDRAM|QDRII+SRAM feature-minimum-operating-supply-voltage-v 1.15
feature-maximum-operating-supply-voltage-v 1.25 feature-packaging
feature-rohs feature-rad-hard
feature-pin-count 484 feature-supplier-package FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A991
feature-svhc No

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP4CE15F23C6N is a field-programmable gate array (FPGA) chip from Intel's Cyclone IV series. It features 14,570 logic elements, 414,720 bits of RAM, and 44 multipliers. The chip operates at a maximum frequency of 350 MHz and is suitable for a wide range of applications such as digital signal processing, communications, and industrial automation.
  • Equivalent

    The equivalent products of EP4CE15F23C6N chip are EP4CE15F23I7N, EP4CE15F23I7LN, and EP4CE15F23I7SN. These chips have similar features, performance, and compatibility with the EP4CE15F23C6N and can be used as replacements in certain applications.
  • Features

    1. Altera Cyclone IV FPGA 2. 14,579 Logic Elements 3. 627 Kbits embedded memory 4. 10 embedded multipliers 5. 4 PLLs 6. 352 user I/Os 7. Single-ended or differential I/O standards 8. 6,016 Kbits embedded memory 9. 2 General Purpose PLLs
  • Pinout

    The EP4CE15F23C6N is a 484-pin FPGA with 158 I/O pins, 6 differential I/O pairs, and 4 LVDS channels. It is designed for high-performance applications such as telecommunications, networking, and industrial automation. The pins can be configured for various functions including data input/output, clock input/output, and configuration control.
  • Manufacturer

    The EP4CE15F23C6N is manufactured by Intel Corporation, a multinational technology company known for producing computer chips, processors, and other hardware components. Intel is one of the largest and most influential technology companies in the world, providing solutions for a wide range of industries including computing, data storage, and communication.
  • Application Field

    The EP4CE15F23C6N is commonly used in applications such as industrial automation, telecommunications, automotive, and aerospace industries. It can also be found in medical devices, consumer electronics, and networking equipment due to its versatility and reliability in processing and control tasks.
  • Package

    The EP4CE15F23C6N chip is in a BGA package type, with a form factor of 23 mm x 23 mm, and a size of 484 mm².

Datasheet PDF

Preliminary Specification EP4CE15F23C6N PDF Download

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