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Intel EP4CE15F17I7N

FPGA Cyclone® IV E Family 15408 Cells 60nm Technology 1.2V 256-Pin FBGA

ISO14001 ISO9001 DUNS

Brands: Intel Corp

Mfr.Part #: EP4CE15F17I7N

Datasheet: EP4CE15F17I7N Datasheet (PDF)

Package/Case: FBGA-256

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2083 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for EP4CE15F17I7N or email to us: Email: [email protected], we will contact you within 12 hours.

EP4CE15F17I7N General Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 165 516096 15408 256-LBGA

Intel Corp Inventory

Specifications

Parameter Value Parameter Value
feature-family-name Cyclone® IV E feature-process-technology 60nm
feature-maximum-number-of-user-i-os 165 feature-number-of-registers
feature-device-logic-cells 15408 feature-device-system-gates
feature-number-of-multipliers 56 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 504 feature-total-number-of-block-ram 56
feature-ethernet-macs feature-supported-ip-core DS1/E1 TDM over Packet IP core|EtherNET/IP|EtherCAT|RapidIO to AXI Bridge Controller (RAB)|Sub-frame Latency JPEG 2000 Encoder (BA130)
feature-supported-ip-core-manufacture Barco Silex/Mobiveil, Inc/Beckhoff Automation GmbH/Softing AG/Aimvalley feature-maximum-number-of-serdes-channels
feature-device-logic-units 15408 feature-device-number-of-dlls-plls 4
feature-transceiver-blocks feature-transceiver-speed-gbps
feature-dedicated-dsp feature-pci-blocks
feature-programmability Yes feature-maximum-internal-frequency-mhz
feature-speed-grade 7 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported SSTL|RSDS|LVDS|LVPECL|HSTL|B-LVDS feature-single-ended-i-o-standards-supported HSTL|SSTL|PCI-X|PCI|LVCMOS|LVTTL
feature-external-memory-interface QDRII+SRAM|DDR2 SDRAM|DDR SDRAM feature-minimum-operating-supply-voltage-v 1.15
feature-maximum-operating-supply-voltage-v 1.25 feature-packaging
feature-rohs feature-rad-hard
feature-pin-count 256 feature-supplier-package FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A991
feature-svhc Yes

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP4CE15F17I7N is a field-programmable gate array (FPGA) chip from Intel's Cyclone IV series. It features 15000 logic elements, 360 Kbits of embedded memory, and 266 multipliers. With its advanced capabilities, this chip is ideal for a wide range of applications in industries such as telecommunications, industrial automation, and automotive.
  • Equivalent

    The equivalent products of EP4CE15F17I7N chip are Altera Cyclone IV EP4CE22F17I7N, Altera Cyclone IV EP4CE10F17I7N, Altera Cyclone IV EP4CE15F17I6N, and Altera Cyclone IV EP4CE22F17I6N. These chips belong to the same family and have similar features and capabilities.
  • Features

    - 15,408 Logic Elements - 270 Embedded 18 x 18 Multipliers - 3,321 Kbits Embedded Memory - 262 Embedded 18 x 18 RAM Blocks - 6 Digital Clock Managers - 4 Phase-Locked Loops - 446 Available I/Os - 1.1V to 1.25V Core Supply Voltage - 3.0V to 3.6V I/O Supply Voltage
  • Pinout

    The EP4CE15F17I7N is a 324-pin Ball Grid Array (BGA) FPGA. It has a maximum of 160 user I/O pins, including dedicated clock pins, configuration pins, and power/ground pins. The functions of the pins include data input/output, clock input/output, configuration and programming, power supply, and ground connections.
  • Manufacturer

    The manufacturer of the EP4CE15F17I7N is Altera Corporation, a semiconductor company specializing in programmable logic devices. They offer a range of field-programmable gate arrays (FPGAs) and integrated circuits for a variety of industries including telecommunications, automotive, and industrial applications.
  • Application Field

    The EP4CE15F17I7N is a field-programmable gate array (FPGA) commonly used in applications such as telecommunications, networking, industrial automation, and automotive systems. It is suitable for high-performance and high-speed applications that require programmable logic with a high level of flexibility and reconfigurability.
  • Package

    The EP4CE15F17I7N chip comes in a Ball Grid Array (BGA) package with 324 pins. It has an integrated circuit form factor and a size of 17 mm x 17 mm.

Datasheet PDF

Preliminary Specification EP4CE15F17I7N PDF Download

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