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Altera EP3C16F256I7

FPGA Cyclone® III Family 15408 Cells 437.5MHz 65nm Technology 1.2V 256-Pin FBGA

ISO14001 ISO9001 DUNS

Brands: Altera Corporation (Intel)

Mfr.Part #: EP3C16F256I7

Datasheet: EP3C16F256I7 Datasheet (PDF)

Package/Case: BGA256

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2279 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for EP3C16F256I7 or email to us: Email: [email protected], we will contact you within 12 hours.

EP3C16F256I7 General Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 168 516096 15408 256-LBGA

Altera Corporation (Intel) Inventory

Specifications

Parameter Value Parameter Value
feature-family-name Cyclone® III feature-process-technology 65nm
feature-maximum-number-of-user-i-os 168 feature-number-of-registers
feature-device-logic-cells 15408 feature-device-system-gates
feature-number-of-multipliers 56 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 504 feature-total-number-of-block-ram 56
feature-ethernet-macs feature-supported-ip-core 32/64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz|10 Gigabit Ethernet MAC|SpeedView Enabled JPEG Encoder (SVE-JPEG-E)|Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|V1 ColdFire
feature-supported-ip-core-manufacture Altera/Freescale/CAST, Inc/MorethanIP/PLDA feature-maximum-number-of-serdes-channels
feature-device-logic-units 15408 feature-device-number-of-dlls-plls 4
feature-transceiver-blocks feature-transceiver-speed-gbps
feature-dedicated-dsp feature-pci-blocks
feature-programmability No feature-maximum-internal-frequency-mhz 437.5
feature-speed-grade 7 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported RSDS|SSTL-18|SSTL-2|HSTL-12|HSTL-15|HSTL-18|LVDS|LVPECL feature-single-ended-i-o-standards-supported HSTL|SSTL|PCI-X|PCI|LVCMOS|LVTTL
feature-external-memory-interface QDRII+SRAM|DDR2 SDRAM feature-minimum-operating-supply-voltage-v 1.15
feature-maximum-operating-supply-voltage-v 1.25 feature-packaging
feature-rohs feature-rad-hard
feature-pin-count 256 feature-supplier-package FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A991
feature-svhc Yes

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP3C16F256I7 is a field-programmable gate array (FPGA) chip from Altera, now part of Intel. It features 16,000 logic elements, 256Kbits of embedded memory, and up to 144 user I/O pins. This chip is ideal for a wide range of applications, including digital signal processing, communication systems, and industrial automation.
  • Equivalent

    Possible equivalent products of the EP3C16F256I7 chip include Altera Cyclone III EP3C16F256C8N, Altera Cyclone III EP3C16F256I8N, and Altera Cyclone III EP3C16F256C6N. These chips offer similar features and performance capabilities to the EP3C16F256I7.
  • Features

    1. EP3C16F256I7 is a Cyclone III FPGA with 15808 logic elements. 2. It has 475.5 Kb of embedded memory and 72 18 x 18 multiplier blocks. 3. The device operates on a 1.2 V core voltage. 4. It features PLLs, internal configuration flash, and supports multiple I/O standards. 5. EP3C16F256I7 is suitable for applications requiring low-power and high-performance.
  • Pinout

    The EP3C16F256I7 is a 256-pin FPGA. It has 16,000 logic elements, 485Kbits of RAM, and 88 differential I/O pairs. It can perform complex functions and algorithms efficiently due to its high logic element count.
  • Manufacturer

    The EP3C16F256I7 is manufactured by Intel Corporation. It is a multinational technology company that produces semiconductor chips and other computer-related products. Intel is known for its CPUs, microprocessors, and other integrated circuits used in a wide range of electronic devices.
  • Application Field

    The EP3C16F256I7 is commonly used in industrial automation, automotive, telecommunications, and consumer electronics applications. It is utilized for functions such as data processing, signal processing, and interfacing with various sensors and peripherals. Its low power consumption and compact size make it suitable for a wide range of embedded systems.
  • Package

    The EP3C16F256I7 is a chip in the FBGA (Fine-pitch Ball Grid Array) package type, with a form factor of 256-pin. This chip measures 17x17mm in size.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

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  • quantity

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  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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