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Altera EP2AGX65DF29I3N
With a voltage range of 2.7mm 0.91.2/3.31.52.5V, this device is suitable for a variety of applications
Brands: Intel
Mfr.Part #: EP2AGX65DF29I3N
Datasheet: EP2AGX65DF29I3N Datasheet (PDF)
Package/Case: FBGA-780
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2327 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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EP2AGX65DF29I3N is a Field-Programmable Gate Array (FPGA) manufactured by Intel Corporation. It is designed for high-performance applications in the fields of graphics, networking, and digital signal processing. The device is built on 65nm technology and features 60,480 logic elements, 160 embedded memory blocks, and 600 digital signal processing (DSP) blocks. It also has 16 transceivers capable of transmitting data at speeds of up to 3.125 Gbps. The device operates at a maximum frequency of 500 MHz and has a power consumption of 3.6W. The FPGA is housed in a 29mm x 29mm package and is RoHS compliant. The EP2AGX65DF29I3N has a variety of I/O options including support for single-ended, differential, and LVDS signaling. It also includes several interfaces such as a PCI Express Gen1, DDR2/DDR3 SDRAM controller, and a gigabit Ethernet MAC. The FPGA is programmable using Intel's Quartus II software and supports both Verilog HDL and VHDL programming languages. With its extensive feature set and high-performance capabilities, the EP2AGX65DF29I3N is an ideal solution for demanding applications in the fields of graphics, networking, and digital signal processing
Features
- Advanced High-Performance Embedded Processor
- 65,000 logic elements
- 2,898 Kbits embedded memory
- 266 maximum user I/Os
- Supports DDR2 SDRAM memory interface
- Low power consumption
- Advanced Digital Signal Processing (DSP) capabilities
- Integrated high-speed transceivers
- Robust security features
- Compact footprint
Application
- Industrial automation
- Communications equipment
- Medical imaging
- Test and measurement
- Security and surveillance
- Video processing
- Broadcasting
- Aerospace and defense
- Automotive
- Consumer electronics
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
| Series | Arria II GX | Number of Logic Elements | 60214 LE |
| Adaptive Logic Modules - ALMs | 25300 ALM | Embedded Memory | 4.45 Mbit |
| Number of I/Os | 364 I/O | Supply Voltage - Min | 870 mV |
| Supply Voltage - Max | 930 mV | Minimum Operating Temperature | - 40 C |
| Maximum Operating Temperature | + 100 C | Data Rate | 1.25 Gb/s |
| Number of Transceivers | 8 Transceiver | Mounting Style | SMD/SMT |
| Package / Case | FBGA-780 | Brand | Intel / Altera |
| Embedded Block RAM - EBR | 791 kbit | Maximum Operating Frequency | 390 MHz |
| Moisture Sensitive | Yes | Number of Logic Array Blocks - LABs | 2530 LAB |
| Operating Supply Voltage | 870 mV to 930 mV | Product Type | FPGA - Field Programmable Gate Array |
| Factory Pack Quantity | 36 | Subcategory | Programmable Logic ICs |
| Total Memory | 5246 kbit | Tradename | Arria |
| Part # Aliases | 974268 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The EP2AGX65DF29I3N chip is a field-programmable gate array (FPGA) designed by Intel. It features 65,536 logic elements, 29 Mbits of embedded memory, and support for various connectivity standards. This chip is commonly used in applications such as telecommunications, industrial automation, and high-performance computing.
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Equivalent
Equivalent products of EP2AGX65DF29I3N chip are Xilinx XC3S200-4FT256C, Lattice XP10 SE40, Altera EP4CE6E22C8N, and Microchip ATSHA204. These chips have similar specifications and functionalities, making them suitable replacements for the EP2AGX65DF29I3N chip. -
Features
1. Altera Cyclone II FPGA 2. 65,536 Logic Elements 3. 4,608 Kbits embedded memory 4. 90 embedded multipliers 5. 333 user I/Os 6. 410 maximum user I/Os 7. 332 pins 8. 29 I/O banks 9. 5.7 ns maximum register-to-register timing 10. Industrial grade temperature support (-40°C to 100°C). -
Pinout
The EP2AGX65DF29I3N is a 672-pin FPGA with 1,697 I/Os. Its functions include digital signal processing, PCI Express, and memory interfaces, suitable for applications in telecommunications, networking, and industrial automation. -
Manufacturer
The EP2AGX65DF29I3N is manufactured by Intel Corporation, known for designing and manufacturing a wide range of computer hardware and software products. Intel Corporation is a multinational technology company specializing in semiconductors, cloud computing, and other related technologies. -
Application Field
The EP2AGX65DF29I3N is commonly used in applications such as industrial automation, communication systems, automotive, aerospace, and defense. Its high-performance capabilities make it ideal for complex real-time processing, networking, and signal processing tasks in a variety of industries. -
Package
The EP2AGX65DF29I3N chip comes in a Ball Grid Array (BGA) package with a form factor of Flip Chip. It has a size of 672-ball, 19x19mm.
Datasheet PDF
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