DA14531-00000FX2
ROHS compliant DA14531-00000FX2 RF Transceiver IC provides reliable wireless connectivity in a small form factor
Brands: Renesas Electronics Corporation
Mfr.Part #: DA14531-00000FX2
Datasheet: DA14531-00000FX2 Datasheet (PDF)
Package/Case: 24-WFQFN,FC
RoHS Status:
Stock Condition: 9748 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $1.211 | $1.211 |
10 | $1.100 | $11.000 |
30 | $1.038 | $31.140 |
100 | $0.931 | $93.100 |
500 | $0.901 | $450.500 |
1000 | $0.887 | $887.000 |
In Stock:9748 PCS
DA14531-00000FX2 General Description
The DA14531-00000FX2 is a compact, low-power Bluetooth 5.1 System-on-Chip (SoC) designed for Internet of Things (IoT) applications. It is part of Dialog Semiconductor's SmartBond TINY family of devices, offering a cost-effective solution for developers looking to add Bluetooth connectivity to their devices.Key features of the DA14531-00000FX2 include a powerful 32-bit Arm Cortex-M0+ processor running at up to 64 MHz, 96 kB of flash memory, and 32 kB of RAM. It also includes a highly efficient power management unit, enabling ultra-low power consumption for extended battery life in battery-operated devices.The SoC supports a wide range of Bluetooth Low Energy (BLE) profiles and services, making it versatile for various IoT applications, such as wearables, smart home devices, and industrial sensors. It also offers a rich set of peripherals, including GPIO, UART, SPI, I2C, and ADC interfaces, for easy integration with sensors and other external devices.
Features
- Ultra-low power consumption
- Compact size
- ARM Cortex-M0 processor
- Integrated flash memory
- Bluetooth Low Energy 5.1 compliant
- Highly integrated design
- Extensive GPIOs and peripherals
- Secure boot loader
- Over-the-air firmware update capabilities
Application
- Internet of Things (IoT)
- Wireless sensor networks
- Home automation
- Health and fitness monitoring
- Industrial control and monitoring
- Smart agriculture
- Bluetooth Low Energy (BLE) applications
- Smart lighting
- Asset tracking
- Wearable devices
Specifications
Parameter | Value | Parameter | Value |
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Pkg. Type | FCGQFN |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The DA14531-00000FX2 chip is a low-power, compact Bluetooth Low Energy (BLE) SoC solution from Dialog Semiconductor. It is specifically designed for IoT and wearable devices, offering advanced features such as secure connections, reduced power consumption, and high performance. The chip's small form factor and integrated peripherals make it ideal for applications requiring a reliable and energy-efficient wireless connectivity solution.
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Equivalent
The equivalent products of DA14531-00000FX2 chip are DA14585-00000AT2, DA14585-00000AT2, and DA14585-00000K32. -
Features
1. Bluetooth Low Energy (BLE) 5.1 connectivity 2. ARM Cortex-M0+ microcontroller 3. Integrated DC/DC converter for increased energy efficiency 4. On-chip flash memory and RAM 5. Support for secure firmware update over-the-air (OTA) 6. Compact footprint ideal for IoT and wearable devices -
Pinout
The DA14531-00000FX2 has 83 pins and is a compact, low-power, highly integrated Bluetooth Low Energy (BLE) system-on-chip (SoC) designed for IoT applications. It features a Cortex-M0 processor, built-in Bluetooth 5.1 stack, advanced security features, and various peripherals for connecting sensors and other devices. -
Manufacturer
The manufacturer of DA14531-00000FX2 is Dialog Semiconductor. It is a semiconductor company that specializes in providing highly integrated mixed-signal products for consumer electronics, automotive, IoT, and industrial applications. Dialog Semiconductor is known for its innovative solutions in power management, audio, and connectivity technologies. -
Application Field
The DA14531-00000FX2 is commonly used in applications such as Internet of Things (IoT) devices, wearables, smart home devices, and industrial applications. Its low power consumption, Bluetooth Low Energy (BLE) connectivity, and small form factor make it ideal for battery-powered devices requiring wireless communication. -
Package
The DA14531-00000FX2 chip is in a WLCSP (Wafer Level Chip Scale Package) form, with dimensions of 2.46mm x 1.86mm x 0.36mm.
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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365 days quality guarantee for all products