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DA14531-00000FX2 48HRS

ROHS compliant DA14531-00000FX2 RF Transceiver IC provides reliable wireless connectivity in a small form factor

ISO14001 ISO9001 DUNS

Brands: Renesas Electronics Corporation

Mfr.Part #: DA14531-00000FX2

Datasheet: DA14531-00000FX2 Datasheet (PDF)

Package/Case: 24-WFQFN,FC

RoHS Status:

Stock Condition: 9748 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $1.211 $1.211
10 $1.100 $11.000
30 $1.038 $31.140
100 $0.931 $93.100
500 $0.901 $450.500
1000 $0.887 $887.000

In Stock:9748 PCS

- +

Quick Quote

Please submit RFQ for DA14531-00000FX2 or email to us: Email: [email protected], we will contact you within 12 hours.

DA14531-00000FX2 General Description

The DA14531-00000FX2 is a compact, low-power Bluetooth 5.1 System-on-Chip (SoC) designed for Internet of Things (IoT) applications. It is part of Dialog Semiconductor's SmartBond TINY family of devices, offering a cost-effective solution for developers looking to add Bluetooth connectivity to their devices.Key features of the DA14531-00000FX2 include a powerful 32-bit Arm Cortex-M0+ processor running at up to 64 MHz, 96 kB of flash memory, and 32 kB of RAM. It also includes a highly efficient power management unit, enabling ultra-low power consumption for extended battery life in battery-operated devices.The SoC supports a wide range of Bluetooth Low Energy (BLE) profiles and services, making it versatile for various IoT applications, such as wearables, smart home devices, and industrial sensors. It also offers a rich set of peripherals, including GPIO, UART, SPI, I2C, and ADC interfaces, for easy integration with sensors and other external devices.

DA14531-00000FX2

Features

  • Ultra-low power consumption
  • Compact size
  • ARM Cortex-M0 processor
  • Integrated flash memory
  • Bluetooth Low Energy 5.1 compliant
  • Highly integrated design
  • Extensive GPIOs and peripherals
  • Secure boot loader
  • Over-the-air firmware update capabilities

Application

  • Internet of Things (IoT)
  • Wireless sensor networks
  • Home automation
  • Health and fitness monitoring
  • Industrial control and monitoring
  • Smart agriculture
  • Bluetooth Low Energy (BLE) applications
  • Smart lighting
  • Asset tracking
  • Wearable devices

Specifications

Parameter Value Parameter Value
Pkg. Type FCGQFN

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The DA14531-00000FX2 chip is a low-power, compact Bluetooth Low Energy (BLE) SoC solution from Dialog Semiconductor. It is specifically designed for IoT and wearable devices, offering advanced features such as secure connections, reduced power consumption, and high performance. The chip's small form factor and integrated peripherals make it ideal for applications requiring a reliable and energy-efficient wireless connectivity solution.
  • Equivalent

    The equivalent products of DA14531-00000FX2 chip are DA14585-00000AT2, DA14585-00000AT2, and DA14585-00000K32.
  • Features

    1. Bluetooth Low Energy (BLE) 5.1 connectivity 2. ARM Cortex-M0+ microcontroller 3. Integrated DC/DC converter for increased energy efficiency 4. On-chip flash memory and RAM 5. Support for secure firmware update over-the-air (OTA) 6. Compact footprint ideal for IoT and wearable devices
  • Pinout

    The DA14531-00000FX2 has 83 pins and is a compact, low-power, highly integrated Bluetooth Low Energy (BLE) system-on-chip (SoC) designed for IoT applications. It features a Cortex-M0 processor, built-in Bluetooth 5.1 stack, advanced security features, and various peripherals for connecting sensors and other devices.
  • Manufacturer

    The manufacturer of DA14531-00000FX2 is Dialog Semiconductor. It is a semiconductor company that specializes in providing highly integrated mixed-signal products for consumer electronics, automotive, IoT, and industrial applications. Dialog Semiconductor is known for its innovative solutions in power management, audio, and connectivity technologies.
  • Application Field

    The DA14531-00000FX2 is commonly used in applications such as Internet of Things (IoT) devices, wearables, smart home devices, and industrial applications. Its low power consumption, Bluetooth Low Energy (BLE) connectivity, and small form factor make it ideal for battery-powered devices requiring wireless communication.
  • Package

    The DA14531-00000FX2 chip is in a WLCSP (Wafer Level Chip Scale Package) form, with dimensions of 2.46mm x 1.86mm x 0.36mm.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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