Xilinx XC7Z015-2CLG485C

Part points

• The XC7Z015-2CLG485C chip is a Field-Programmable Gate Array (FPGA) from Xilinx. It belongs to the Zynq-7000 series and offers a dual-core ARM Cortex-A9 processor. With a CLG485 package, it offers 15,850 logic cells and 2200 MHz of system performance. This chip is designed for a wide range of applications, including embedded systems, industrial automation, and automotive electronics.

• Equivalent

  The equivalent products of the XC7Z015-2CLG485C chip are XC7Z010, XC7Z012, and XC7Z014.

• Features

  The XC7Z015-2CLG485C is a Zynq-7000 XC7Z015 programmable system-on-chip (SoC) with 2 ARM Cortex-A9 cores, configurable logic blocks, integrated memory, and various I/O interfaces. It operates at a core voltage of 0.95V to 1.05V and has a maximum clock frequency of 866 MHz.

• Pinout

  The XC7Z015-2CLG485C is a field-programmable gate array (FPGA) with a pin count of 485. It has a built-in Zynq-7000 system-on-chip (SoC) that combines an ARM Cortex-A9 processor with programmable logic. The pins are used for various functions such as input/output, power supply, configuration, and communication with external devices.

• Manufacturer

  The manufacturer of the XC7Z015-2CLG485C is Xilinx Inc. It is an American technology company that specializes in the development and production of programmable logic devices (PLDs), software development tools, and intellectual property (IP) cores. Xilinx is widely recognized for its field-programmable gate arrays (FPGAs) and is a leading provider of programmable logic solutions in various industries including aerospace, automotive, telecommunications, and data center applications.

• Application Field

  The XC7Z015-2CLG485C is an advanced system-on-chip (SoC) device primarily used in applications that require high-speed processing and programmable logic capabilities. Its application areas include embedded computing, industrial automation, networking, medical imaging, automotive systems, and aerospace.

• Package

  The XC7Z015-2CLG485C chip has a package type of CFBGA (Column Grid Array), a form factor of 19 x 19 mm, and a size of 485 balls/pins.