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Renesas 80HCPS1848CHMGI

Serial RapidIO® Switch 784-FCBGA (29x29)

Ovaga Certification

Brands: Renesas Technology Corp

Mfr.Part #: 80HCPS1848CHMGI

Datasheet: 80HCPS1848CHMGI Datasheet (PDF)

Package/Case: 784-BBGA, FCBGA

RoHS Status:

Stock Condition: 2162 pcs, New Original

Product Type: Integrated Circuits (ICs)

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $325.365 $325.365

In Stock:2162 PCS

- +

*Products eligible for online ordering ship within 1-2 business days,please contact us for exact shipping times.

Quick Quote

Please submit RFQ for 80HCPS1848CHMGI or email to us: Email: [email protected], we will contact you within 12 hours.

80HCPS1848CHMGI General Description

The IDT CPS-1848 provides a full, non-blocking bandwidth of 240 Gbps for up to 18 logical ports. The CPS-1848 device utilizes a 5th generation switch fabric, building upon Gen1 CPS and Tsi switching architectures. This new switch uses patent pending features to minimize latency, ensure scheduling fairness, and provide superior multicast throughput. The CPS-1848's 6.25 Gbaud SerDes is ideal for backplanes, yet can run even lower power for local connectivity.This performance is realized over twice the transmission channel distance and three orders of magnitude improvement in bit error rate (BER) compared to the very capable Gen1 standard.

Learn more: IDT RapidIO Development Systems

80hcps1848chmgi

Features

  • Designed to Serial RapidIO 2.1 Specification
  • 48 lanes, with up to 12x4, 18x2, 18x1 port configurations
  • 6 Enhanced quads configurable as 1x4, 2x2, 4x1
  • 6 quads configurable as 1x4, 1x2, 1x1
  • Full-duplex 240 Gbps non-blocking bandwidth
  • 1.25, 2.5, 3.125, 5.0, or 6.25 Gbaud
  • 29x29 FCBGA
  • Long reach 100-cm 2 connector
  • As low as 300mW per 10 Gbps data rate is up to 40% more power efficient vs. RapidIO 1.3 switches
80hcps1848chmgi

Specifications

Parameter Value Parameter Value
Pin Count 784 Package Category BGA
Released Date Feb 14, 2020 Last Modified Date Aug 1, 2023 1:51 PM UTC
Series CPS-1848 Package Tray
Product Status Active DigiKey Programmable Not Verified
Type Serial RapidIO® Switch Applications Wireless Infrastructure
Mounting Type Surface Mount Package / Case 784-BBGA, FCBGA
Supplier Device Package 784-FCBGA (29x29)

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The 80HCPS1848CHMGI chip is a microcontroller unit manufactured by Intel. It belongs to the 80HCPS series and integrates various functions like a central processing unit, memory, and input/output capabilities into a single chip. This chip is commonly used in embedded systems and helps in delivering efficient and reliable performance for a wide range of applications.
  • Pinout

    The 80HCPS1848CHMGI is a 184-pin BGA package. The pin count refers to the number of physical pins on the package. The specific function of each pin on the 80HCPS1848CHMGI will depend on the specific microcontroller or integrated circuit it is used in.
  • Application Field

    The 80HCPS1848CHMGI is a microcontroller with embedded high-speed CAN transceivers, suitable for various applications including industrial automation, automotive control systems, and home automation. Other potential application areas include robotics, medical devices, and smart grid systems.
  • Package

    The 80HCPS1848CHMGI chip has a package type of BGA (Ball Grid Array), a form factor of HTQFP (Heat Transfer Quad Flat Package), and a size of 18mm x 18mm.

Datasheet PDF

Preliminary Specification 80HCPS1848CHMGI PDF Download

Key points

  • The 80HCPS1848CHMGI chip is a microcontroller unit manufactured by Intel. It belongs to the 80HCPS series and integrates various functions like a central processing unit, memory, and input/output capabilities into a single chip. This chip is commonly used in embedded systems and helps in delivering efficient and reliable performance for a wide range of applications.
  • Pinout

    The 80HCPS1848CHMGI is a 184-pin BGA package. The pin count refers to the number of physical pins on the package. The specific function of each pin on the 80HCPS1848CHMGI will depend on the specific microcontroller or integrated circuit it is used in.
  • Application Field

    The 80HCPS1848CHMGI is a microcontroller with embedded high-speed CAN transceivers, suitable for various applications including industrial automation, automotive control systems, and home automation. Other potential application areas include robotics, medical devices, and smart grid systems.
  • Package

    The 80HCPS1848CHMGI chip has a package type of BGA (Ball Grid Array), a form factor of HTQFP (Heat Transfer Quad Flat Package), and a size of 18mm x 18mm.

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  • quantity

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  • shipping

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  • guarantee

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