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RF Balun 2.4GHz ~ 2.5GHz 50 / 50Ohm 4-WFBGA, FCBGA

ISO14001 ISO9001 DUNS

Brands: ST

Mfr.Part #: BALF-NRG-01D3

Datasheet: BALF-NRG-01D3 Datasheet (PDF)

Package/Case: WLCSP-4

Product Type: Balun

RoHS Status:

Stock Condition: 2545 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for BALF-NRG-01D3 or email to us: Email: [email protected], we will contact you within 12 hours.

BALF-NRG-01D3 General Description

STMicroelectronics BALF-NRG-01D3 is an ultra miniature balun. The BALF-NRG-01D3 integrates matching network and harmonics filter. Matching impedance has been customized for the BlueNRG ST transceiver (both QFN and WLCSP versions). It is using STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.SensorTile connectable sensor node: plug or sold.



  • 50 Ω nominal input / conjugate match to BlueNRG device
  • Low insertion loss
  • Low amplitude imbalance
  • Low phase imbalance
  • Wafer level chip scale package (WLCSP)


Parameter Value Parameter Value
Packing Type Tape And Reel RoHs compliant Ecopack2
Grade Industrial


Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.


Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.


1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.


  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the BALF-NRG-01D3 component, you may consider these replacement and alternative parts:

Part Number




Part Number :   BALF-NRG-01D3

Brands :  

Package :  

Description :  

Part points

  • The BALF-NRG-01D3 chip is an integrated solution for Bluetooth Low Energy (BLE) applications. It combines a low-power RF front-end and a DC-DC converter in a compact package, enabling wireless communication with low energy consumption. The chip is commonly used in IoT devices, wearables, and other battery-powered applications requiring BLE connectivity.
  • Features

    BALF-NRG-01D3 is an ultra-small and efficient balun offering excellent RF performance for Nordic Semiconductor's wireless SoCs. It provides impedance matching and conversion between the RF chip and the antenna, enabling reliable and high-quality wireless communication.
  • Pinout

    The BALF-NRG-01D3 is a balun transformer with 5 pins. It is primarily used for impedance matching and signal conversion in RF applications, such as Bluetooth Low Energy (BLE) devices.
  • Application Field

    The BALF-NRG-01D3 is an integrated balun and RF filter designed for ultra-wideband applications. It is commonly used in wireless communication systems, IoT devices, and other applications requiring efficient transmission and reception of RF signals. Its compact size and performance make it suitable for various low power and smart home applications.
  • Package

    The BALF-NRG-01D3 chip comes in a QFN package with a form of IC (Integrated Circuit). Its size is unspecified and requires further information.

Datasheet PDF

Preliminary Specification BALF-NRG-01D3 PDF Download

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