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BSM200GD60DLC
IGBT Module Full Bridge 600 V 226 A 700 W Chassis Mount Module
Brands: INFINEON TECHNOLOGIES AG
Mfr.Part #: BSM200GD60DLC
Datasheet: BSM200GD60DLC Datasheet (PDF)
Package/Case: EconoPACK 3A
RoHS Status:
Stock Condition: 6572 pcs, New Original
Product Type: IGBT Modules
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $293.805 | $293.805 |
| 30 | $281.890 | $8456.700 |
In Stock:6572 PCS
BSM200GD60DLC General Description
IGBT Module Full Bridge 600 V 226 A 700 W Chassis Mount Module
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Source Content uid | BSM200GD60DLC | Rohs Code | Yes |
| Part Life Cycle Code | Obsolete | Ihs Manufacturer | INFINEON TECHNOLOGIES AG |
| Part Package Code | MODULE | Package Description | MODULE-19 |
| Pin Count | 39 | Reach Compliance Code | not_compliant |
| ECCN Code | EAR99 | HTS Code | 8541.29.00.95 |
| Samacsys Manufacturer | Infineon | Case Connection | ISOLATED |
| Collector Current-Max (IC) | 226 A | Collector-Emitter Voltage-Max | 600 V |
| Configuration | BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE | Gate-Emitter Voltage-Max | 20 V |
| JESD-30 Code | R-XUFM-X19 | Number of Elements | 6 |
| Number of Terminals | 19 | Operating Temperature-Max | 150 °C |
| Package Body Material | UNSPECIFIED | Package Shape | RECTANGULAR |
| Package Style | FLANGE MOUNT | Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Polarity/Channel Type | N-CHANNEL | Power Dissipation-Max (Abs) | 700 W |
| Qualification Status | Not Qualified | Surface Mount | NO |
| Terminal Form | UNSPECIFIED | Terminal Position | UPPER |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | Transistor Element Material | SILICON |
| Turn-off Time-Nom (toff) | 326 ns | Turn-on Time-Nom (ton) | 229 ns |
| VCEsat-Max | 2.45 V |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The BSM200GD60DLC chip is an IGBT module designed for high power applications such as motor drives and inverters. It has a maximum voltage rating of 600V and a current rating of 200A. The chip features low on-state voltage drop, high short circuit capability, and fast switching speed. It also incorporates advanced thermal design and protection features for efficient and reliable operation.
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Equivalent
The equivalent products of the BSM200GD60DLC chip are the BSM200GD60DLCK and the BSM200GD60DLCP, which are also IGBT modules. -
Features
The main features of BSM200GD60DLC are dual IGBT modules, with a current rating of 200A and a voltage rating of 600V. It has low saturation voltage and low switching loss, making it suitable for various power electronic applications such as motor drives, inverters, and UPS systems. -
Pinout
The BSM200GD60DLC is a dual IGBT module with a pin count of 19. Its main function is to control the power flow between a high-voltage DC bus and a three-phase motor. The module is commonly used in applications such as electric vehicles, industrial drives, and renewable energy systems. -
Manufacturer
The manufacturer of the BSM200GD60DLC is Infineon Technologies AG. It is a German semiconductor manufacturer specializing in power semiconductors and system solutions for various industries, including automotive, industrial, and renewable energy. -
Application Field
The BSM200GD60DLC is a module designed for a wide range of applications such as motor control in industrial automation, robotics, power supplies, solar inverters, and renewable energy systems. Its high power density, low thermal resistance, and high current capability make it suitable for demanding applications that require efficient and reliable power conversion. -
Package
The BSM200GD60DLC chip has a package type of module, a form of six-pack, and a size of compact.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products
