Intel 5CEFA7F31C8N

Part points

• The 5CEFA7F31C8N chip is a programmable logic device (PLD) manufactured by Intel. It belongs to the Cyclone V series and offers a high-performance, low-power solution for various applications. The chip features a large number of logic elements, embedded memory blocks, and digital signal processing (DSP) blocks. It has a wide range of applications, including industrial automation, automotive, telecommunications, and more.

• Equivalent

  The equivalent products of the 5CEFA7F31C8N chip are other members of the Cyclone V FPGA family from Intel (formerly Altera), such as the 5CEBA7F31C7N or 5CEFA7F15C8N. These chips have similar features and capabilities but may vary in terms of performance, power consumption, and other specifications.

• Features

  The 5CEFA7F31C8N is a field-programmable gate array (FPGA) device produced by Intel. It features 31,920 logic elements, 1,350 Kbits of embedded memory, and a maximum of 294 user I/Os. It operates at a speed of 300MHz and provides high-performance capabilities for various applications requiring programmable digital logic.

• Pinout

  The 5CEFA7F31C8N is a FPGA (Field-Programmable Gate Array) with 31,680 logic elements available. It has a pin count of 324 and serves various functions including data processing, digital signal processing, and control functions in electronic devices.

• Manufacturer

  The manufacturer of the 5CEFA7F31C8N is Intel. Intel is a multinational technology company that designs and manufactures semiconductor chips and other related products. They are one of the leading manufacturers in the industry and provide a wide range of integrated circuits, including programmable logic devices like the 5CEFA7F31C8N.

• Application Field

  The 5CEFA7F31C8N is a field-programmable gate array (FPGA) device produced by Intel. It can be used in various application areas such as telecommunications, industrial automation, automotive, medical equipment, and aerospace. Its versatility makes it suitable for a wide range of applications that require high-performance and programmability.

• Package

  The 5CEFA7F31C8N chip comes in a BGA (Ball Grid Array) package with a 31mm x 31mm form factor.