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TI TCAN332DR

Name: TCAN332DR
Rating: 4.5 (10 reviews)

1/1 Transceiver CANbus 8-SOIC

Brands: TI

Mfr.Part #: TCAN332DR

Datasheet: TCAN332DR Datasheet (PDF)

Package/Case: SOIC-8

Product Type: CAN Interface IC

RoHS Status:

Stock Condition: 8926 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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TCAN332DR General Description

The TCAN33x family of devices is compatible with the ISO 11898 High Speed CAN (Controller Area Network) Physical Layer standard. TCAN330, TCAN332, TCAN334 and TCAN337 are specified for data rates up to 1 Mbps. Pending the release of the updated version of ISO 11898-2 including CAN FD, additional timing parameters defining loop delay symmetry are specified for the TCAN330G, TCAN332G, TCAN334G and TCAN337G devices. The devices include many protection features including driver and receiver Dominant Time Out (DTO) providing CAN network robustness. Integrated 12 kV IEC-61000-4-2 ESD Contact Discharge protection eliminates the need of additional components for system level robustness.

The use of single 3.3-V supply enables the transceivers to directly interface with 3.3-V CAN controllers/MCUs. In addition, these devices are fully compatible with other 5-V CAN transceivers on the same bus.

These devices have excellent EMC performance due to matched Dominant and Recessive Common Modes. Ultra low power Shutdown and Standby modes make these devices attractive for battery powered applications.

This family of devices is available in standard 8-pin SOIC packages for drop-in compatibility and in small SOT-23 packages for space-constrained applications.

Features

3.3-V Single supply operation
Data rates up to 5 Mbps (TCAN33xG devices)
Compatible with ISO 11898-2
SOIC-8 and SOT-23 package options
Operatinles:
- Normal mode (all devices)
- Low power standby mode with wake (TCAN334)
- Silent mode (TCAN330, TCAN337)
- Shutdown mode (TCAN330, TCAN334)
Wide common mode range of operation ±12 V
Bus pin fault protection of ±14 V
Total loop delay < 135 ns
Wide ambient operation temperature range: –40°C to 125°C
Optimized behavior when unpowered:
- Bus and logic pins are high impedance (no load to operating bus or application)
- Power up / down glitch free operation
Excellent EMC performance
Protection features:
- ESD Protection of bus terminals
  - HBM ESD Protection exceeds ±25 kV
  - IEC61000-4-2 ESD Contact discharge protection exceeds ±12 kV
- Driver dominant time out (TXD DTO)
- Receiver dominant time out (RXD DTO)
- Fault output pin (TCAN337 only)
- Undervoltage protection on V_CC
- Thermal shutdown protection
- Current limiting on bus pins

Specifications

Parameter	Value	Parameter	Value
Protocols	CAN, CAN FD	Number of channels	1
Supply voltage (V)	3 to 3.6	Bus fault voltage (V)	-14 to 14
Signaling rate (max) (MBits)	1	Rating	Catalog
Operating temperature range (°C)	-40 to 125	Low-power mode	No
Common-mode voltage (V)	-12 to 12

Shipping

	Ship Fee	Lead Time
DHL	$20.00-$40.00 (0.50 KG)	2-5 days
Fedex	$20.00-$40.00 (0.50 KG)	2-5 days
UPS	$20.00-$40.00 (0.50 KG)	2-5 days
TNT	$20.00-$40.00 (0.50 KG)	2-5 days
EMS	$20.00-$40.00 (0.50 KG)	2-5 days
REGISTERED AIR MAIL	$20.00-$40.00 (0.50 KG)	2-5 days

Processing Time：Shipping fee depend on different zone and country.

Payment

Terms of payment		Hand Fee
	Wire Transfer	charge US$30.00 banking fee.
	Paypal	charge 4.0% service fee.
	Credit Card	charge 3.5% service fee.
	Western Union	charge US.00 banking fee.
	Money Gram	charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

Step1 :Product
Step2 :Vacuum packaging
Step3 :Anti-static bag
Step4 :Individual packaging
Step5 :Packaging boxes
Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

Part points

The TCAN332DR is a CAN FD transceiver chip designed for high-speed communication in automotive and industrial applications. It supports data rates up to 8 Mbps and offers enhanced EMC performance. Its robust design and advanced features make it a reliable choice for CAN networks in harsh environments.
Equivalent

The equivalent products of TCAN332DR chip are TCAN332DG, TCAN334DG, and TCAN334DR. These chips are similar in functionality and features, offering CAN FD controller and transceiver capabilities for industrial applications.
Features

1. Integrated CAN transceiver with advanced protection and diagnostic features 2. High-speed data rates up to 2 Mbps 3. Wide supply voltage range of 3.3 V to 5.5 V 4. Thermo-protect for safe operation in harsh environments 5. Fault detection and reporting for reliable communication 6. Standard compliant CAN FD support for flexible data transmission
Pinout

The TCAN332DR is a 3.3V CAN FD controller with integrated transceiver. It has a 8-pin SOIC package. Pin functions include VCC, GND, TXD, RXD, SLP, STB, CANH, and CANL.
Manufacturer

The TCAN332DR is manufactured by Texas Instruments, a multinational semiconductor company. They specialize in designing and manufacturing a range of semiconductor products, including analog and embedded processors.
Application Field

The TCAN332DR is commonly used in automotive applications for communication between various control modules, such as in-vehicle infotainment systems and advanced driver assistance systems. It is also utilized in industrial automation, building automation, and medical equipment for reliable and high-speed data communication over Controller Area Network (CAN) bus networks.
Package

The TCAN332DR chip is a surface-mount package type, comes in the SOIC form, and has a size of 8-SOIC.