Intel 10M50DAF484C8G
MAX® 10 Field Programmable Gate Array (FPGA) IC 360 1677312 50000 484-BGA
Brands: Intel Corp
Mfr.Part #: 10M50DAF484C8G
Datasheet: 10M50DAF484C8G Datasheet (PDF)
Package/Case: TFBGA-484
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2152 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To Bom10M50DAF484C8G General Description
MAX® 10 Field Programmable Gate Array (FPGA) IC 360 1677312 50000 484-BGA
Specifications
Parameter | Value | Parameter | Value |
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Pin Count | 484 | Package Category | BGA |
Released Date | Feb 28, 2020 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The 10M50DAF484C8G chip is a field-programmable gate array (FPGA) manufactured by Intel. It is part of the Intel® MAX® 10 FPGA family and features 50,000 logic elements in a 484-pin package. This chip offers programmable logic, digital signal processing (DSP) capabilities, and analog blocks, making it suitable for a wide range of applications such as industrial control systems, automotive electronics, and Internet of Things (IoT) devices.
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Equivalent
Some equivalent products of the 10M50DAF484C8G chip include 10M16DAF484C8G, 10M40DAF484C8G, and 10M25DAF484C8G. -
Features
The 10M50DAF484C8G is an Intel Cyclone 10 FPGA with features like 10,000 logic elements, memory blocks, embedded multipliers, and embedded non-volatile configuration memory. It supports configurable I/O standards, offers clock management resources, and includes built-in IP cores for various applications. -
Pinout
The pin count of the 10M50DAF484C8G is 484. It is a field programmable gate array (FPGA) and can be programmed to perform various digital logic functions. -
Manufacturer
The manufacturer of the 10M50DAF484C8G is Intel Corporation. It is an American multinational technology company that specializes in the design, development, and manufacturing of semiconductors, computer processors, and other related products for various industries including consumer electronics, telecommunications, automotive, and more. -
Application Field
The 10M50DAF484C8G is a field-programmable gate array (FPGA) manufactured by Intel. It can be used in various application areas such as aerospace and defense, industrial automation, automotive, broadcast and professional audio, and medical equipment. Its high-performance capabilities and flexibility make it suitable for a wide range of applications requiring complex digital logic processing. -
Package
The 10M50DAF484C8G chip has a package type of FBGA, a form factor of 484-ball grid array, and a size of 23 mm x 23 mm.
Datasheet PDF
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