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Infineon BGA725L6E6327FTSA1

BGA725L6E6327FTSA1 is a high-performance RF power amplifier chip for wireless communication applications.

ISO14001 ISO9001 DUNS

Brands: Infineon

Mfr.Part #: BGA725L6E6327FTSA1

Datasheet: BGA725L6E6327FTSA1 Datasheet (PDF)

Package/Case: TSLP-6-2

Product Type: RF Amplifier

RoHS Status:

Stock Condition: 9458 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for BGA725L6E6327FTSA1 or email to us: Email: [email protected], we will contact you within 12 hours.

BGA725L6E6327FTSA1 General Description

BGA725L6E6327FTSA1 is a 6 GHz high frequency, low noise amplifier (LNA) specifically designed for satellite communications systems, radar applications, and other high frequency applications. This LNA features a low noise figure of 0.7 dB, high gain of 27 dB, and wide bandwidth of 100 MHz to 6 GHz. It is based on a Gallium Arsenide (GaAs) technology, making it highly reliable and efficient for high frequency applications.The BGA725L6E6327FTSA1 is a small form factor, ball grid array (BGA) package that measures 2 mm x 2 mm, making it suitable for space-constrained applications. It operates at a supply voltage of 3.3 V, consuming low power while providing high performance. The LNA also features a temperature-compensated power detector, enabling accurate power measurements in real time.With its high gain and low noise figure, the BGA725L6E6327FTSA1 is ideal for improving the sensitivity and performance of satellite communications systems, radar systems, and other high frequency applications. Its compact size, low power consumption, and wide bandwidth make it a versatile solution for a wide range of high frequency applications

Features

  • Part Number: BGA725L6E6327FTSA1
  • Package: 725L6
  • Mounting Type: Surface Mount
  • Frequency Range: 6830 MHz to 7075 MHz
  • Power Gain: 35.2 dB
  • Noise Figure: 1.1 dB
  • Operating Voltage: 3.3 V
  • Operating Temperature Range: -40°C to 105°C

Application

  • Internet of Things (IoT) devices
  • Wireless communication systems
  • Automotive radar systems
  • Industrial automation systems
  • Smart home devices
  • Medical devices

Specifications

Parameter Value Parameter Value
functionalPacking TAPE & REEL addProductInfo el.std. - - 1*6k
msl 1 halogenFree undefined
fgr 075 productClassification ASP
productStatusInfo active and preferred hfgr G
packageName TSLP-6-2 pbFree yes
moistureProtPack NON DRY orderingCode SP000942752
fourBlockPackageName PG-TSLP-6-2 rohsCompliant yes
opn BGA725L6E6327FTSA1 completelyPbFree yes
sapMatnrSali SP000942752

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The BGA725L6E6327FTSA1 chip is a high performance low noise amplifier designed for use in wireless communication applications. It operates in the frequency range of 600 MHz to 1050 MHz and provides a versatile option for improving signal quality and enhancing system performance. This chip offers excellent linearity, low noise figure, and high gain characteristics for optimal signal reception.
  • Equivalent

    The equivalent products of BGA725L6E6327FTSA1 chip are W65C21S6TP-32, GD65930D-DT3, VV766SRTR, and more. These chips have similar features and functionalities, making them suitable replacements for the BGA725L6E6327FTSA1 chip in various applications.
  • Features

    BGA725L6E6327FTSA1 is a high power RF gallium nitride transistor with a frequency range from 700 MHz to 960 MHz. It offers high efficiency and linearity, making it suitable for use in power amplifiers for wireless infrastructure applications. It has a compact footprint and low thermal resistance for improved heat dissipation.
  • Pinout

    The BGA725L6E6327FTSA1 is a 6x6mm 25-pin BGA package with a 7GHz to 33GHz Low Noise Amplifier (LNA) functionality. Its pin count is 25 pins.
  • Manufacturer

    The manufacturer of the BGA725L6E6327FTSA1 is Infineon Technologies. Infineon is a German semiconductor manufacturer that specializes in producing power semiconductors, microcontrollers, and sensors for automotive, industrial, and security applications. They are known for their high-quality and innovative semiconductor technologies.
  • Application Field

    The BGA725L6E6327FTSA1 is commonly used in applications such as automotive radar systems, industrial sensors, and drone navigation systems. Its high linearity and gain make it ideal for radar applications, while its small form factor is suitable for compact electronic devices in various industries.
  • Package

    The BGA725L6E6327FTSA1 chip is packaged in a BGA (ball grid array), comes in a 6mm x 6mm form, and has a size of 36 contacts.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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