Xilinx XCZU9EG-2FFVB1156I

Part points

• The XCZU9EG-2FFVB1156I chip is a programmable system-on-chip (SoC) developed by Xilinx. It combines a powerful processing system with programmable logic, enabling flexibility and high-performance in various applications. It features a Zynq Ultrascale+ MPSoC architecture, with a dual-core Arm Cortex-A53 processor, a quad-core Arm Cortex-R5 real-time processor, and an integrated FPGA fabric. The chip provides advanced capabilities for embedded system design, including AI acceleration, image and signal processing, and connectivity.

• Features

  XCZU9EG-2FFVB1156I is a member of the Xilinx Zynq UltraScale+ MPSoC family. It features a quad-core ARM Cortex-A53 processor and a dual-core Cortex-R5 processor, along with an FPGA fabric with 600K logic cells. It supports DDR4 memory, PCIe Gen3, 4K video encoding/decoding, and various connectivity options, making it suitable for diverse high-performance applications.

• Pinout

  The XCZU9EG-2FFVB1156I is a Field-Programmable Gate Array (FPGA) with a pin count of 1156. It can be used for various functions, such as digital signal processing, image and video processing, networking, and computational storage.

• Manufacturer

  The manufacturer of the XCZU9EG-2FFVB1156I is Xilinx, Inc. Xilinx is an American technology company specializing in designing and manufacturing of programmable logic devices, including chips, development tools, and software. They are considered a leading provider of FPGA (Field Programmable Gate Array) products, which are versatile semiconductors used for various applications in industries such as automotive, aerospace, telecommunications, and more.

• Application Field

  The XCZU9EG-2FFVB1156I is a System-on-Chip (SoC) device developed by Xilinx. It is designed for applications in the fields of artificial intelligence, machine learning, data processing, and high-performance computing. With its advanced capabilities like high-speed serial connectivity, programmable logic fabric, and multi-core Arm Cortex-A53 processing, it is suitable for various industries including automotive, aerospace, telecommunications, and more.

• Package

  The XCZU9EG-2FFVB1156I chip has a package type of Flip Chip BGA, form factor of FFVB, and a size of 1156 balls.