Xilinx XCF08PV0G48C
Brands: AMD Xilinx, Inc
Mfr.Part #: XCF08PV0G48C
Datasheet: XCF08PV0G48C Datasheet (PDF)
Package/Case: TSOP-48
Product Type: Programmable Logic ICs
XCF08PV0G48C General Description
XCF08PV0G48C is a part number for a flash memory chip manufactured by Xilinx. Here are some of its features:
Features
- 8 Mb (megabits) of memory
- 3.3V power supply
- 48-ball VFBGA (very fine pitch ball grid array) package
- SPI (serial peripheral interface) interface
- -40°C to +85°C temperature range
Application
- Communications equipment
- Automotive electronics
- Industrial automation
- Medical devices
- Consumer electronics
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XCF08PV0G48C chip is a programmable non-volatile memory (PROM) device developed by Xilinx. It offers a capacity of 8 Mb and is designed for embedded systems applications. The chip can be reprogrammed multiple times, making it suitable for flexible system designs. It is commonly used in electronic devices, automotive systems, and industrial control applications.
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Equivalent
There are no readily available equivalent products for the XCF08PV0G48C chip, as it is a specific model designed by Xilinx. It is a 3.3-volt programmable read-only memory (PROM) chip used for storing configuration data in digital systems. -
Features
XCF08PV0G48C is a Flash configuration device with a capacity of 8 megabits (Mb) from Xilinx. It offers in-system programmability and supports multiple FPGA platforms. It also has a low-power consumption feature and a wide operating voltage range. -
Pinout
The XCF08PV0G48C has a pin count of 48. Its primary function is as a non-volatile configuration memory device. It is commonly used in applications requiring reliable storage of configuration data for FPGA (Field-Programmable Gate Array) devices. -
Manufacturer
The manufacturer of the XCF08PV0G48C is Xilinx Inc. Xilinx is an American technology company specializing in the development and production of programmable logic devices and related technologies. -
Application Field
The XCF08PV0G48C is a Field Programmable Gate Array (FPGA) device that can be used in various application areas such as automotive systems, industrial control, wireless communication, robotics, and aerospace. It offers high-performance processing capabilities and flexible programmability, making it suitable for a wide range of applications. -
Package
The XCF08PV0G48C chip is offered in a 48-ball Fine-Pitch Ball Grid Array (FBGA) package type with a 0.8 mm pitch. Its form factor is in a small outline package (SOP) with a size of approximately 7 mm x 7 mm.
Datasheet PDF
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