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Xilinx XCF08PV0G48C

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XCF08PV0G48C

Datasheet: XCF08PV0G48C Datasheet (PDF)

Package/Case: TSOP-48

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2175 pcs, New Original

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XCF08PV0G48C General Description

XCF08PV0G48C is a part number for a flash memory chip manufactured by Xilinx. Here are some of its features:

xcf08pv0g48c

Features

  • 8 Mb (megabits) of memory
  • 3.3V power supply
  • 48-ball VFBGA (very fine pitch ball grid array) package
  • SPI (serial peripheral interface) interface
  • -40°C to +85°C temperature range

Application

  • Communications equipment
  • Automotive electronics
  • Industrial automation
  • Medical devices
  • Consumer electronics
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Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XCF08PV0G48C chip is a programmable non-volatile memory (PROM) device developed by Xilinx. It offers a capacity of 8 Mb and is designed for embedded systems applications. The chip can be reprogrammed multiple times, making it suitable for flexible system designs. It is commonly used in electronic devices, automotive systems, and industrial control applications.
  • Equivalent

    There are no readily available equivalent products for the XCF08PV0G48C chip, as it is a specific model designed by Xilinx. It is a 3.3-volt programmable read-only memory (PROM) chip used for storing configuration data in digital systems.
  • Features

    XCF08PV0G48C is a Flash configuration device with a capacity of 8 megabits (Mb) from Xilinx. It offers in-system programmability and supports multiple FPGA platforms. It also has a low-power consumption feature and a wide operating voltage range.
  • Pinout

    The XCF08PV0G48C has a pin count of 48. Its primary function is as a non-volatile configuration memory device. It is commonly used in applications requiring reliable storage of configuration data for FPGA (Field-Programmable Gate Array) devices.
  • Manufacturer

    The manufacturer of the XCF08PV0G48C is Xilinx Inc. Xilinx is an American technology company specializing in the development and production of programmable logic devices and related technologies.
  • Application Field

    The XCF08PV0G48C is a Field Programmable Gate Array (FPGA) device that can be used in various application areas such as automotive systems, industrial control, wireless communication, robotics, and aerospace. It offers high-performance processing capabilities and flexible programmability, making it suitable for a wide range of applications.
  • Package

    The XCF08PV0G48C chip is offered in a 48-ball Fine-Pitch Ball Grid Array (FBGA) package type with a 0.8 mm pitch. Its form factor is in a small outline package (SOP) with a size of approximately 7 mm x 7 mm.

Datasheet PDF

Preliminary Specification XCF08PV0G48C PDF Download

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