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Xilinx XCV1000-4BG560I

Virtex® Field Programmable Gate Array (FPGA) IC 404 131072 27648 560-LBGA Exposed Pad, Metal

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XCV1000-4BG560I

Datasheet: XCV1000-4BG560I Datasheet (PDF)

Package/Case: BGA560

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 2,176 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XCV1000-4BG560I or email to us: Email: [email protected], we will contact you within 12 hours.

XCV1000-4BG560I General Description

Virtex® Field Programmable Gate Array (FPGA) IC 404 131072 27648 560-LBGA Exposed Pad, Metal

AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Manufacturer Xilinx Inc. Product Category Embedded - FPGAs (Field Programmable Gate Array)
Series VirtexR Package-Case 560-LBGA, Metal
Operating-Temperature -40°C ~ 100°C (TJ) Mounting-Type Surface Mount
Voltage-Supply 2.375 V ~ 2.625 V Supplier-Device-Package 560-MBGA (42.5x42.5)
Number-of-Gates 1124022 Number-of-I-O 404
Number-of-LABs-CLBs 6144 Number-of-Logic-Elements-Cells 27648
Total-RAM-Bits 131072 Tags XCV1000-4BG, XCV1000-4B, XCV1000-4, XCV1000, XCV10, XCV1, XCV
Rohs Code No Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC Part Package Code BGA
Package Description BGA-560 Pin Count 560
Reach Compliance Code not_compliant HTS Code 8542.39.00.01
Clock Frequency-Max 250 MHz Combinatorial Delay of a CLB-Max 0.8 ns
JESD-30 Code S-PBGA-B560 JESD-609 Code e0
Length 42.5 mm Moisture Sensitivity Level 3
Number of CLBs 6144 Number of Equivalent Gates 1124022
Number of Inputs 404 Number of Logic Cells 27648
Number of Outputs 404 Number of Terminals 560
Organization 6144 CLBS, 1124022 GATES Package Body Material PLASTIC/EPOXY
Package Code LBGA Package Equivalence Code BGA560,33X33,50
Package Shape SQUARE Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Seated Height-Max 1.7 mm
Supply Voltage-Max 2.625 V Supply Voltage-Min 2.375 V
Supply Voltage-Nom 2.5 V Surface Mount YES
Technology CMOS Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL Terminal Pitch 1.27 mm
Terminal Position BOTTOM Time@Peak Reflow Temperature-Max (s) 30
Width 42.5 mm

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XCV1000-4BG560I chip is a programmable logic device (PLD) that offers advanced features for designing and implementing digital circuits. It has a capacity of 1 million system gates and 4-input look-up tables (LUTs) providing flexibility and versatility in logic functions. The chip is commonly used in industries like telecommunications, automotive, and aerospace for various applications like data processing, signal processing, and control systems.
  • Features

    The XCV1000-4BG560I is a Field Programmable Gate Array (FPGA) device. It features 1,000,000 system ASIC gates, 176 user I/O pins, a core voltage of 1.8V, and a speed grade of -4. With 560 ball grid array (BGA) package, it offers high-density and programmable logic capabilities for various applications.
  • Pinout

    The XCV1000-4BG560I is an FPGA (Field Programmable Gate Array) IC with a pin count of 560. Its specific functions and pin assignments will depend on the specific configuration and design implemented by the user, as FPGAs can be programmed and reconfigured to perform different functions as required.
  • Manufacturer

    The manufacturer of the XCV1000-4BG560I is Xilinx Inc. It is a semiconductor manufacturing company that specializes in the development and production of programmable logic devices, such as field-programmable gate arrays (FPGAs) and programmable system-on-chips (SoCs).
  • Application Field

    The XCV1000-4BG560I is a versatile FPGA that can be used in various application areas such as telecommunications, automotive, industrial automation, medical devices, and consumer electronics. Its high logic density and advanced performance capabilities make it suitable for complex digital designs, signal processing, and system integration.

Datasheet PDF

Preliminary Specification XCV1000-4BG560I PDF Download

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