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$5000Xilinx XCV1000-4BG560I
Virtex® Field Programmable Gate Array (FPGA) IC 404 131072 27648 560-LBGA Exposed Pad, Metal
Brands: AMD Xilinx, Inc
Mfr.Part #: XCV1000-4BG560I
Datasheet: XCV1000-4BG560I Datasheet (PDF)
Package/Case: BGA560
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 2,176 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XCV1000-4BG560I General Description
Virtex® Field Programmable Gate Array (FPGA) IC 404 131072 27648 560-LBGA Exposed Pad, Metal
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Manufacturer | Xilinx Inc. | Product Category | Embedded - FPGAs (Field Programmable Gate Array) |
Series | VirtexR | Package-Case | 560-LBGA, Metal |
Operating-Temperature | -40°C ~ 100°C (TJ) | Mounting-Type | Surface Mount |
Voltage-Supply | 2.375 V ~ 2.625 V | Supplier-Device-Package | 560-MBGA (42.5x42.5) |
Number-of-Gates | 1124022 | Number-of-I-O | 404 |
Number-of-LABs-CLBs | 6144 | Number-of-Logic-Elements-Cells | 27648 |
Total-RAM-Bits | 131072 | Tags | XCV1000-4BG, XCV1000-4B, XCV1000-4, XCV1000, XCV10, XCV1, XCV |
Rohs Code | No | Part Life Cycle Code | Obsolete |
Ihs Manufacturer | XILINX INC | Part Package Code | BGA |
Package Description | BGA-560 | Pin Count | 560 |
Reach Compliance Code | not_compliant | HTS Code | 8542.39.00.01 |
Clock Frequency-Max | 250 MHz | Combinatorial Delay of a CLB-Max | 0.8 ns |
JESD-30 Code | S-PBGA-B560 | JESD-609 Code | e0 |
Length | 42.5 mm | Moisture Sensitivity Level | 3 |
Number of CLBs | 6144 | Number of Equivalent Gates | 1124022 |
Number of Inputs | 404 | Number of Logic Cells | 27648 |
Number of Outputs | 404 | Number of Terminals | 560 |
Organization | 6144 CLBS, 1124022 GATES | Package Body Material | PLASTIC/EPOXY |
Package Code | LBGA | Package Equivalence Code | BGA560,33X33,50 |
Package Shape | SQUARE | Package Style | GRID ARRAY, LOW PROFILE |
Peak Reflow Temperature (Cel) | 225 | Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Qualification Status | Not Qualified | Seated Height-Max | 1.7 mm |
Supply Voltage-Max | 2.625 V | Supply Voltage-Min | 2.375 V |
Supply Voltage-Nom | 2.5 V | Surface Mount | YES |
Technology | CMOS | Terminal Finish | Tin/Lead (Sn63Pb37) |
Terminal Form | BALL | Terminal Pitch | 1.27 mm |
Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | 30 |
Width | 42.5 mm |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XCV1000-4BG560I chip is a programmable logic device (PLD) that offers advanced features for designing and implementing digital circuits. It has a capacity of 1 million system gates and 4-input look-up tables (LUTs) providing flexibility and versatility in logic functions. The chip is commonly used in industries like telecommunications, automotive, and aerospace for various applications like data processing, signal processing, and control systems.
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Features
The XCV1000-4BG560I is a Field Programmable Gate Array (FPGA) device. It features 1,000,000 system ASIC gates, 176 user I/O pins, a core voltage of 1.8V, and a speed grade of -4. With 560 ball grid array (BGA) package, it offers high-density and programmable logic capabilities for various applications. -
Pinout
The XCV1000-4BG560I is an FPGA (Field Programmable Gate Array) IC with a pin count of 560. Its specific functions and pin assignments will depend on the specific configuration and design implemented by the user, as FPGAs can be programmed and reconfigured to perform different functions as required. -
Manufacturer
The manufacturer of the XCV1000-4BG560I is Xilinx Inc. It is a semiconductor manufacturing company that specializes in the development and production of programmable logic devices, such as field-programmable gate arrays (FPGAs) and programmable system-on-chips (SoCs). -
Application Field
The XCV1000-4BG560I is a versatile FPGA that can be used in various application areas such as telecommunications, automotive, industrial automation, medical devices, and consumer electronics. Its high logic density and advanced performance capabilities make it suitable for complex digital designs, signal processing, and system integration.
Datasheet PDF
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