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Xilinx XC7Z010-2CLG225I

IC SOC CORTEX-A9 ARTIX-7 225BGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC7Z010-2CLG225I

Datasheet: XC7Z010-2CLG225I Datasheet (PDF)

Package/Case: BGA-225

Product Type: System On Chip (SoC)

RoHS Status:

Stock Condition: 2007 pcs, New Original

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Please submit RFQ for XC7Z010-2CLG225I or email to us: Email: [email protected], we will contact you within 12 hours.

XC7Z010-2CLG225I General Description

Psoc, Arm Cortex-A9, 766Mhz, Csbga-225; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:766Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Csbga; No. Of Pins:225Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z010-2CLG225I

xc7z010-2clg225i

Features

  • It has a dual-core ARM Cortex-A9 processor
  • 28,000 logic cells and 240 KB of Block RAM
  • 80 DSP slices
  • 180 user I/O pins
  • 10/100/1000 Ethernet MAC
  • USB 2.0 and SD/SDIO interfaces
  • 6.6 Mb of internal memory

Application

  • Embedded systems
  • Industrial automation
  • Motor control
  • Aerospace and defense
  • Medical equipment
  • Video processing and transmission
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Specifications

Parameter Value Parameter Value
Case/Package BGA Contact Plating Copper, Silver, Tin
Number of Pins 225 Core Architecture ARM
Data Bus Width 32 b Frequency 766 MHz
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB Max Frequency 733 MHz
Max Operating Temperature 100 °C Min Operating Temperature -40 °C
Number of I/Os 86 Operating Supply Voltage 1 V
Peripherals DMA

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC7Z010-2CLG225I component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC7Z020-1CLG484I

Brands :  

Package :   BGA484

Description :   PSoC / MPSoC Microprocessor, Zynq-7000 Family, ARM Cortex-A9, 667 MHz, BGA-484

Part Number :   XC7Z030-1SBG485I

Brands :  

Package :   484-FBGA, FCBGA

Description :   PSoC / MPSoC Microprocessor, Zynq-7000 XC7Z030 Series, ARM Cortex-A9, 667 MHz, FCBGA-485

Part Number :   XC7Z045-2FFG900I

Brands :  

Package :   900-BBGAFCBGA

Description :   PSoC / MPSoC Microprocessor, Zynq-7000 Family, ARM Cortex-A9, 800 MHz, FCBGA-900

Part Number :   XC7Z100-2FFG900I

Brands :  

Package :   BGA-900

Description :   MPU XC7Z100 32-Bit 1000MHz 900-Pin FFG (Alt: XC7Z100-2FFG900I)

Part points

  • XC7Z010-2CLG225I is a system on a chip (SOC) from Xilinx. It is a member of the Zynq-7000 family, combining a dual-core ARM Cortex-A9 processor with programmable FPGA logic. The chip offers high-speed processing and customization capabilities, making it suitable for embedded applications requiring real-time processing and hardware acceleration. It has 28,000 logic cells, 17,600 LUTs, and 220 I/O pins.
  • Features

    The XC7Z010-2CLG225I is a System-on-Chip (SoC) device, with a dual-core ARM Cortex-A9 processor, programmable logic (FPGA), and extensive peripherals. It has 28,000 logic cells, 17.5Kb block RAM, 143 DSP slices, and supports various communication interfaces such as Ethernet, USB, and SPI. It operates at a maximum frequency of 667MHz.
  • Pinout

    The XC7Z010-2CLG225I is a 225-pin package, which indicates the number of pins on the device. As for the function, it is a Xilinx Zynq-7000 System-on-Chip (SoC) that integrates a dual-core ARM Cortex-A9 processor with programmable logic and other peripherals to provide a flexible and high-performance computing solution.
  • Manufacturer

    The manufacturer of the XC7Z010-2CLG225I is Xilinx Inc. Xilinx is a renowned American technology company specializing in the development of programmable logic devices and associated software. They are known for their field-programmable gate arrays (FPGAs) and adaptive compute acceleration platforms, which are used in a wide range of applications including telecommunications, automotive, aerospace, and more.
  • Application Field

    The XC7Z010-2CLG225I is an FPGA (Field-Programmable Gate Array) that is commonly used in a wide range of application areas, including industrial automation, aerospace and defense, telecommunications, automotive electronics, medical devices, and consumer electronics. It offers high-performance processing capabilities and flexible programmability, making it suitable for various applications that require high-speed data processing and customization.
  • Package

    The XC7Z010-2CLG225I chip is packaged as a Ball Grid Array (BGA). It has a grid of solder balls located on its bottom surface. The BGA package has a size of 225mm², indicating the overall dimensions of the chip.

Datasheet PDF

Preliminary Specification XC7Z010-2CLG225I PDF Download

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