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Xilinx XC7V2000T-1FLG1925C

IC FPGA 1200 I/O 1925FCBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC7V2000T-1FLG1925C

Datasheet: XC7V2000T-1FLG1925C Datasheet (PDF)

Package/Case: BGA-1925

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 3,143 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XC7V2000T-1FLG1925C or email to us: Email: [email protected], we will contact you within 12 hours.

XC7V2000T-1FLG1925C General Description

Virtex?-7 T Field Programmable Gate Array (FPGA) IC 1200 47628288 1954560 1924-BBGA, FCBGA

xc7v2000t-1flg1925c

Features

  • It has a capacity of 2 million logic cells and 68.5 Mb of internal memory
  • It supports up to 2000 user I/O pins and has 48 high-speed transceivers with data rates up to 12.5 Gbps
  • It has an on-chip temperature sensor, voltage regulators, and power-on-reset (POR) circuitry
  • It is built on a 28nm process technology and has a total power consumption of 66W.
xc7v2000t-1flg1925c

Application

  • The XC7V2000T-1FLG1925C FPGA is commonly used in high-performance computing, networking, and communication applications, such as high-speed switches, routers, and network interface cards (NICs).
  • It can also be used in applications that require high-speed signal processing, such as video processing, image recognition, and digital signal processing (DSP).
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Case/Package FCBGA Max Operating Temperature 85 °C
Max Supply Voltage 1.03 V Min Operating Temperature 0 °C
Min Supply Voltage 970 mV Number of ADC Channels 1
Number of I/Os 1200 Number of Logic Blocks (LABs) 152700
Number of Logic Elements/Cells 1.95456e+06 Number of Registers 2.4432e+06
Number of Transceivers 0 RAM Size 5.7 MB
Speed Grade -1

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC7V2000T-1FLG1925C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XCV2000E-6FG1156C

Brands :  

Package :   BGA1156

Description :   Virtex-E 1.8 V Field Programmable Gate Arrays

Part Number :   XCV2000E-7FG1156C

Brands :  

Package :   1156-BBGA

Description :   Virtex-E 1.8 V Field Programmable Gate Arrays FPGA

Part Number :   XCV2000E-8FG1156C

Brands :  

Package :   1156-BBGA

Description :   FPGA Virtex-E Family 518.4K Gates 43200 Cells 416MHz 0.18um Technology 1.8V 1156-Pin FBGA

Part Number :   XCV2000E-9FG1156C

Brands :  

Package :  

Description :  

Part Number :   XCV2000EFG1156C

Brands :  

Package :  

Description :  

Part points

  • The XC7V2000T-1FLG1925C chip is a high-performance FPGA (Field-Programmable Gate Array) developed by Xilinx. It offers a wide range of digital logic functions and flexible programming capabilities. With a capacity of 2 million system logic cells and numerous I/O interfaces, it is specifically designed for advanced applications in industries like telecommunications, data centers, aerospace, and defense.
  • Features

    The XC7V2000T-1FLG1925C is a field-programmable gate array (FPGA) from Xilinx. It features 1,870,880 logic cells, high-speed serial I/O, up to 1,664 I/O pins, and on-chip memory of up to 84 Mb. It also supports various communication protocols, including PCIe, Ethernet, and SATA, making it suitable for a range of applications like cloud computing, networking, and wireless communication.
  • Pinout

    The XC7V2000T-1FLG1925C is an FPGA (Field-Programmable Gate Array) device. It has a pin count of 1925. The exact functions of each pin depend on the design implemented in the FPGA, as it is a versatile hardware device that can be programmed to perform various tasks based on the user's requirements.
  • Manufacturer

    Xilinx Inc. is the manufacturer of the XC7V2000T-1FLG1925C. It is an American technology company specializing in the development and production of programmable logic devices (PLDs), including field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs). Xilinx's products are widely used in sectors such as aerospace, defense, telecommunications, automotive, and industrial applications.
  • Application Field

    The XC7V2000T-1FLG1925C is a field-programmable gate array (FPGA) designed by Xilinx for high-performance computing applications. It can be used in various areas such as aerospace and defense, telecommunications, industrial automation, automotive, and scientific research. It offers high logic capacity, flexible connectivity options, and enhanced performance capabilities, making it suitable for complex and demanding applications.
  • Package

    The XC7V2000T-1FLG1925C chip is in the FLGA (Fine-pitch Land Grid Array) package type. It is in a 1925-ball package form and has a size of approximately 35 mm x 35 mm.

Datasheet PDF

Preliminary Specification XC7V2000T-1FLG1925C PDF Download

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