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Xilinx XC7A100T-1FGG676I

Artix-7 FPGA, 300 User I/Os, 8 GTP, 676-Ball BGA, Speed Grade 1, Industrial Grade, FGG676, RoHS

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC7A100T-1FGG676I

Datasheet: XC7A100T-1FGG676I Datasheet (PDF)

Package/Case: BGA676

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 3,738 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XC7A100T-1FGG676I or email to us: Email: [email protected], we will contact you within 12 hours.

XC7A100T-1FGG676I General Description

No. Of Logic Blocks:15850; No. Of Macrocells:101440; Fpga Family:artix-7; Logic Case Style:fcbga; No. Of Pins:676Pins; No. Of Speed Grades:1; Total Ram Bits:4860Kbit; No. Of I/o S:300I/o S; Clock Management:mmcm, Pll; Msl:- Rohs Compliant: Yes

Features

IC FPGA 300 I/O 676FBGAIC FPGA 300 I/O 676FBGA
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Pin Count 676 Package Category BGA
Released Date Aug 8, 2022

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC7A100T-1FGG676I chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It is part of the Xilinx 7 series and features a Spartan-7 FPGA. The chip has 101,440 logic cells, 6,800 slices, and 240 DSP slices. It operates on 1.2V core voltage and supports various I/O standards. It provides high-performance and low-power capabilities for applications in areas such as automotive, industrial automation, and telecommunications.
  • Equivalent

    Some equivalent products of the XC7A100T-1FGG676I chip are: XC7A100T-1FGG484I, XC7A100T-1FGG484C, and XC7A100T-1FGG676C.
  • Features

    The XC7A100T-1FGG676I is an FPGA chip from the Xilinx Artix-7 family. It has a capacity of 101,440 logic cells, 6,800 slices, 240 DSP slices, and 4.9 Mb of memory. It supports various I/O interfaces, including PCIe and Gigabit Ethernet. It operates at a maximum frequency of 825 MHz and can be programmed using VHDL, Verilog, or the Xilinx Vivado Design Suite.
  • Manufacturer

    The manufacturer of the XC7A100T-1FGG676I is Xilinx Inc., a leading American technology company specializing in the development of adaptive and intelligent computing solutions. They are renowned for their extensive portfolio of programmable logic devices, software development tools, and design services that enable customers to create customizable and high-performance digital systems.
  • Application Field

    The XC7A100T-1FGG676I is an FPGA that can be used in a wide range of applications, including wireless communications, automotive systems, industrial control, medical devices, and aerospace and defense. It offers a high level of performance, flexibility, and integration, making it suitable for various complex and high-speed applications.
  • Package

    The XC7A100T-1FGG676I chip has a package type of Flip-Chip Grid Array (FCGA), a form of the package that uses an array of solder balls to connect the chip to the circuit board. The size of the chip is 676-ball with a 1 mm pitch.

Datasheet PDF

Preliminary Specification XC7A100T-1FGG676I PDF Download

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