Orders Over
$5000Xilinx XC7A100T-1FGG676I
Artix-7 FPGA, 300 User I/Os, 8 GTP, 676-Ball BGA, Speed Grade 1, Industrial Grade, FGG676, RoHS
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7A100T-1FGG676I
Datasheet: XC7A100T-1FGG676I Datasheet (PDF)
Package/Case: BGA676
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 3,738 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC7A100T-1FGG676I General Description
No. Of Logic Blocks:15850; No. Of Macrocells:101440; Fpga Family:artix-7; Logic Case Style:fcbga; No. Of Pins:676Pins; No. Of Speed Grades:1; Total Ram Bits:4860Kbit; No. Of I/o S:300I/o S; Clock Management:mmcm, Pll; Msl:- Rohs Compliant: Yes
Features
IC FPGA 300 I/O 676FBGAIC FPGA 300 I/O 676FBGASpecifications
Parameter | Value | Parameter | Value |
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Pin Count | 676 | Package Category | BGA |
Released Date | Aug 8, 2022 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7A100T-1FGG676I chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It is part of the Xilinx 7 series and features a Spartan-7 FPGA. The chip has 101,440 logic cells, 6,800 slices, and 240 DSP slices. It operates on 1.2V core voltage and supports various I/O standards. It provides high-performance and low-power capabilities for applications in areas such as automotive, industrial automation, and telecommunications.
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Equivalent
Some equivalent products of the XC7A100T-1FGG676I chip are: XC7A100T-1FGG484I, XC7A100T-1FGG484C, and XC7A100T-1FGG676C. -
Features
The XC7A100T-1FGG676I is an FPGA chip from the Xilinx Artix-7 family. It has a capacity of 101,440 logic cells, 6,800 slices, 240 DSP slices, and 4.9 Mb of memory. It supports various I/O interfaces, including PCIe and Gigabit Ethernet. It operates at a maximum frequency of 825 MHz and can be programmed using VHDL, Verilog, or the Xilinx Vivado Design Suite. -
Manufacturer
The manufacturer of the XC7A100T-1FGG676I is Xilinx Inc., a leading American technology company specializing in the development of adaptive and intelligent computing solutions. They are renowned for their extensive portfolio of programmable logic devices, software development tools, and design services that enable customers to create customizable and high-performance digital systems. -
Application Field
The XC7A100T-1FGG676I is an FPGA that can be used in a wide range of applications, including wireless communications, automotive systems, industrial control, medical devices, and aerospace and defense. It offers a high level of performance, flexibility, and integration, making it suitable for various complex and high-speed applications. -
Package
The XC7A100T-1FGG676I chip has a package type of Flip-Chip Grid Array (FCGA), a form of the package that uses an array of solder balls to connect the chip to the circuit board. The size of the chip is 676-ball with a 1 mm pitch.
Datasheet PDF
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