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$5000Xilinx XC6VSX315T-1FFG1156I
Virtex®-6 SXT Field Programmable Gate Array (FPGA) IC 600 25952256 314880 1156-BBGA, FCBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC6VSX315T-1FFG1156I
Datasheet: XC6VSX315T-1FFG1156I Datasheet (PDF)
Package/Case: FCBGA-1156
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 2,334 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC6VSX315T-1FFG1156I General Description
Virtex®-6 SXT Field Programmable Gate Array (FPGA) IC 600 25952256 314880 1156-BBGA, FCBGA
Features
- It has a large number of programmable logic cells, which can be configured to implement complex digital circuits.
- It also includes built-in memory blocks, high-speed serial transceivers, and other digital signal processing (DSP) resources.
- XC6VSX315T-1FFG1156I operates on a 1.0V core voltage, with a maximum operating frequency of 550MHz.
- It has 315,000 logic cells, 12.8Mb of Block RAM, and 360 DSP slices, making it suitable for high-end applications that require high performance and flexibility.
Application
- XC6VSX315T-1FFG1156I can be used in a wide range of applications, including high-performance computing, telecommunications, aerospace, and defense, among others.
- Its high-speed serial transceivers make it suitable for applications that require high-speed data transmission over long distances, such as data center networking and wireless communication.
- Its large logic capacity and built-in DSP resources make it ideal for implementing complex digital signal processing algorithms used in video and image processing, radar systems, and other applications.
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Case/Package | FCBGA | Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount | Number of Pins | 1156 |
| Max Operating Temperature | 100 °C | Max Supply Voltage | 1.05 V |
| Min Operating Temperature | -40 °C | Min Supply Voltage | 950 mV |
| Number of I/Os | 600 | Number of Logic Blocks (LABs) | 24600 |
| Number of Logic Elements/Cells | 314880 | RAM Size | 3.1 MB |
| Speed Grade | 1 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC6VSX315T-1FFG1156I component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part points
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XC6VSX315T-1FFG1156I is a high-performance, field-programmable gate array (FPGA) chip from Xilinx. It offers a large capacity and advanced features, making it suitable for a wide range of applications. The chip has 315,000 logic cells, 1,200 input/output pins, and various built-in functions for efficient design implementation. It offers high-speed performance, low power consumption, and flexibility, making it a popular choice in the electronics industry.
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Equivalent
Equivalent products of the XC6VSX315T-1FFG1156I chip include the XC6VLX315T-1FFG1156I and the XC6VSX315T-2FFG1156I. -
Features
The key features of the XC6VSX315T-1FFG1156I FPGA are its high-performance logic capabilities, advanced memory resources, wide range of I/O options, and flexible clocking technology. It also offers easy system integration, efficient power management, and is suitable for a variety of applications including telecommunications, aerospace, and defense. -
Pinout
The XC6VSX315T-1FFG1156I is a field-programmable gate array (FPGA) with a pin count of 1156. Its function is to enable programmable logic and digital signal processing on a single chip, making it suitable for a wide range of applications including aerospace, automotive, and telecommunications. -
Manufacturer
The manufacturer of the XC6VSX315T-1FFG1156I is Xilinx. Xilinx is a technology company that specializes in the development and manufacturing of programmable logic devices and associated software tools. They are a leading provider of field-programmable gate arrays (FPGAs) and programmable system-on-chips (SoCs) that enable flexible and customizable hardware solutions for various applications in industries such as automotive, telecommunications, and aerospace. Note: The provided response is based on general knowledge and does not pertain specifically to the XC6VSX315T-1FFG1156I. -
Application Field
The XC6VSX315T-1FFG1156I is a programmable logic device that is commonly used in high-performance applications such as aerospace and defense, telecommunications, scientific research, and industrial automation. It offers advanced features and capabilities to meet the demanding requirements of these industries. -
Package
The XC6VSX315T-1FFG1156I chip has a Flip Chip Ball Grid Array (FBGA) package type, with 1156 solder balls for connection. The size of the chip is classified as 1FFG, which indicates a medium-sized package.
Datasheet PDF
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