Xilinx XC6SLX9-3CSG225C

Part points

• The XC6SLX9-3CSG225C is a Field-Programmable Gate Array (FPGA) chip made by Xilinx. It belongs to the Spartan-6 LX family, with 9,152 logic slices and 108 I/O pins. The chip operates at a speed grade of -3, providing improved performance. It also has 36 BlockRAM and 4 Digital Clock Manager (DCM) modules, making it suitable for a variety of applications requiring reconfigurable digital logic.

• Equivalent

  Some equivalent products of the XC6SLX9-3CSG225C chip include the XC6SLX9-2CSG225C, XC6SLX9-1CSG225C, and XC6SLX9L-3CSG225C.

• Features

  The XC6SLX9-3CSG225C is an FPGA from the Xilinx Spartan-6 family. It features 9,152 logic cells, 576 Kbits of block RAM, and 32 DSP slices. The device operates at a speed grade of -3, has a 225-pin CSG225 package, and supports a wide range of I/O standards and interfaces.

• Pinout

  The XC6SLX9-3CSG225C is an FPGA (Field Programmable Gate Array) with a pin count of 225 and a 3-speed grade designation. It is part of the Spartan-6 family of devices from Xilinx and is primarily used for creating custom logic circuits and digital signal processing applications.

• Manufacturer

  The manufacturer of the XC6SLX9-3CSG225C is Xilinx, Inc. Xilinx is a semiconductor company that specializes in designing and manufacturing programmable logic devices, such as field-programmable gate arrays (FPGAs) and related technologies. They are known for their high-performance, flexible, and customizable solutions for a wide range of applications in various industries, including automotive, telecommunications, data centers, and more.

• Application Field

  The XC6SLX9-3CSG225C is a Field-Programmable Gate Array (FPGA) used in various applications including automotive, industrial automation, aerospace, consumer electronics, and telecommunications. Its small form factor, low power consumption, and high-speed capabilities make it suitable for a range of embedded systems, signal processing, and control applications.

• Package

  The XC6SLX9-3CSG225C chip has a 225-ball chip scale grid array (CSG225) package type. The form is a BGA (ball grid array). The size of the chip is compact, with dimensions of 13mm x 13mm.