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$5000Xilinx XC3SD1800A-4FGG676I
Spartan®-3A DSP Field Programmable Gate Array (FPGA) IC 519 1548288 37440 676-BGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3SD1800A-4FGG676I
Datasheet: XC3SD1800A-4FGG676I Datasheet (PDF)
Package/Case: BGA-676
Product Type: FPGAs (Field Programmable Gate Array)
RoHS Status:
Stock Condition: 3,038 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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XC3SD1800A-4FGG676I General Description
FPGA, SPARTAN-3ADSP, 1800K, 676FBGA; No. of Macrocells:37440; Operating Temperature Range:0°C to +100°C; No. of Pins:676; SVHC:No SVHC (18-Jun-2010); Package / Case:FBGA; Logic IC Base Number:3SD1800; Logic IC Function:FPGA; Supply Voltage Max:1.26V; Supply Voltage Min:1.14V; Termination Type:SMD; Frequency:667MHz; I/O Interface Standard:LVTTL, LVCMOS, HSTL, SSTL; I/O Output Drive:3.3V, 2.5V, 1.8V, 1.5V, 1.2V; No. of I/O Lines:519; Programmable Logic Type:FPGA
Features
- It has a 1.8 million system gate count and 1,116 I/O pins.
- It operates with a maximum frequency of 550 MHz.
- It has a 90 nm CMOS technology, which provides low power consumption and high-speed performance.
- It supports various communication protocols such as PCI Express, Ethernet, and Serial RapidIO.
Application
- Digital signal processing (DSP)
- High-speed data processing
- Video and image processing
- Network processing
- Aerospace and defense applications
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Case/Package | FBGA | Mount | Surface Mount |
| Number of Pins | 676 | Frequency | 667 MHz |
| Max Operating Temperature | 100 °C | Max Supply Voltage | 1.26 V |
| Min Operating Temperature | -40 °C | Min Supply Voltage | 1.14 V |
| Number of Gates | 1.8e+06 | Number of I/Os | 519 |
| Number of Logic Blocks (LABs) | 4160 | Number of Logic Elements/Cells | 37440 |
| Number of Macrocells | 37440 | Operating Supply Voltage | 1.2 V |
| RAM Size | 189 kB | Speed Grade | 4 |
| Termination | SMD/SMT |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3SD1800A-4FGG676I component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : Altera/Intel
Brands :
Package :
Description : Stratix IV GX EP4SGX180HF35C2N
Part Number : Microsemi/Actel
Brands :
Package :
Description : ProASIC3 A3P1000-2FG484I
Part points
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The XC3SD1800A-4FGG676I chip is an FPGA (Field-Programmable Gate Array) designed by Xilinx Inc. It offers a high level of integration and performance, with a capacity of 1.8 million system gates. The chip operates at a speed grade of -4 and is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA). It is widely used in industries such as telecommunications, aerospace, and automotive for various applications requiring programmable logic solutions.
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Equivalent
There are no direct equivalent products to the XC3SD1800A-4FGG676I chip. However, alternative FPGA chips from other manufacturers that offer similar features and performance include Intel's Stratix IV GX EP4SGX530, Xilinx's Virtex-6 XC6VLX760, and Lattice's ECP3-70 FPGA. -
Features
XC3SD1800A-4FGG676I is a field-programmable gate array (FPGA) with 1800k logic cells, featuring high performance and low power consumption. It supports advanced memory interfaces and clocking capabilities, making it suitable for a wide range of applications. The device is designed to be reliable and provides a flexible and scalable system integration option. -
Pinout
The XC3SD1800A-4FGG676I has a pin count of 676 and is a field-programmable gate array (FPGA). It is capable of implementing various digital functions and is commonly used in applications such as communication systems, video processing, and embedded computing. -
Manufacturer
The manufacturer of the XC3SD1800A-4FGG676I is Xilinx. Xilinx is a multinational technology company known for its programmable logic devices and associated development software. They specialize in the design and production of advanced integrated circuits and system-on-chips (SoCs) for a wide range of applications in different industries like automotive, aerospace, telecommunications, and more. -
Application Field
The XC3SD1800A-4FGG676I is a field-programmable gate array (FPGA). It can be used in a variety of application areas, including telecommunications, automotive, aerospace, industrial automation, and medical devices. It offers high-performance and flexibility, making it suitable for various complex digital systems and signal processing tasks. -
Package
The XC3SD1800A-4FGG676I chip has a BGA (Ball Grid Array) package type, in a 676-pin grid array form, and its size is 27mm x 27mm.
Datasheet PDF
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