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Xilinx XC3SD1800A-4CSG484I

Spartan®-3A DSP Field Programmable Gate Array (FPGA) IC 309 1548288 37440 484-FBGA, CSPBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3SD1800A-4CSG484I

Datasheet: XC3SD1800A-4CSG484I Datasheet (PDF)

Package/Case: BGA-484

RoHS Status:

Stock Condition: 3226 pcs, New Original

Product Type: Programmable Logic ICs

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $69.439 $69.439
30 $66.480 $1994.400

In Stock:3226 PCS

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Quick Quote

Please submit RFQ for XC3SD1800A-4CSG484I or email to us: Email: [email protected], we will contact you within 12 hours.

XC3SD1800A-4CSG484I General Description

FPGA, SPARTAN-3A, DSP, 484CSBGA; No. of Logic Blocks:4160; No. of Gates:1800000; No. of Macrocells:37440; Family Type:Spartan-3A; No. of Speed Grades:4; Total RAM Bits:1548288; No. of I/O's:309; Clock Management:DCM; Core Supply Voltage Range:1.2V; I/O Supply Voltage:3.3V; Operating Frequency Max:320MHz; Operating Temperature Range:-40°C to +100°C; Logic Case Style:BGA; No. of Pins:484; MSL:MSL 3 - 168 hours; SVHC:No SVHC (19-Dec-2011)

xc3sd1800a-4csg484i

Features

  • 1.8 million system gates
  • 352 I/O pins
  • 18 DSP48A1 slices
  • 864KB block RAM
  • Clock management tiles
  • MicroBlaze processor-compatible

Application

  • Industrial control systems
  • Communications systems
  • Automotive systems
  • Aerospace and defense
  • Medical equipment
  • Video and image processing
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Case/Package BGA Mount Surface Mount
Number of Pins 484 Max Operating Temperature 100 °C
Max Supply Voltage 1.2 V Min Operating Temperature -40 °C
Number of Gates 1.8e+06 Number of I/Os 309
Number of Logic Blocks (LABs) 4160 Number of Logic Elements/Cells 37440
Number of Macrocells 37440 RAM Size 189 kB
Speed Grade 4

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3SD1800A-4CSG484I component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC3SD1800A-4FTG256C

Brands :  

Package :  

Description :  

Part Number :   XC3SD1800A-4FTG256I

Brands :  

Package :  

Description :  

Part Number :   XC3SD1800A-4FTG400C

Brands :  

Package :  

Description :  

Part Number :   XC3SD1800A-4FTG400I

Brands :  

Package :  

Description :  

Part Number :   XC3SD1800A-4FTG676C

Brands :  

Package :  

Description :  

Part Number :   XC3SD1800A-4FTG676I

Brands :  

Package :  

Description :  

Part Number :   XC3SD1800A-4FGG676C

Brands :  

Package :   BGA-676

Description :   Extended Spartan-3A FPGAs, Package: 4FGG676C

Part Number :   XC3SD1800A-4FGG676I

Brands :  

Package :   BGA-676

Description :   1.8M Gates 37440 Cells 667MHz 90nm Technology 1.2V

Part points

  • The XC3SD1800A-4CSG484I chip is a member of the Xilinx Spartan-3A FPGA family. It features a density of 1.8 million system gates, operates at a speed grade of -4, and comes in a 484-ball ceramic grid array package. This chip is designed for applications that require high processing capabilities and programmability, making it suitable for a wide range of industries and projects.
  • Equivalent

    There are no direct equivalent products for the XC3SD1800A-4CSG484I chip. However, alternative options could include similar model lines like Xilinx Spartan-3A, Xilinx Spartan-3AN, or Xilinx Spartan-3L series chips, which offer similar functionality and features.
  • Features

    XC3SD1800A-4CSG484I is an FPGA by Xilinx with a capacity of 1.8 million system gates. It operates at a speed grade of -4 and comes in a 484-pin ceramic quad flat package (CQFP). Features include a low power consumption, advanced system-level power management, and a comprehensive set of I/O standards and protocols.
  • Pinout

    The XC3SD1800A-4CSG484I is an FPGA (Field Programmable Gate Array) device with a pin count of 484 and is housed in a CS (Chip Scale) package. The specific pin functions can vary depending on the specific configuration of the FPGA and the design implementation.
  • Manufacturer

    The manufacturer of the XC3SD1800A-4CSG484I is Xilinx, Inc. It is a semiconductor company that specializes in the development and production of programmable logic devices, software, and intellectual property cores.
  • Application Field

    The XC3SD1800A-4CSG484I is an FPGA (Field-Programmable Gate Array) used for various applications including telecommunications, industrial control, automotive, computer systems, and medical devices. It provides high logic capacity, low power consumption, and high-performance signal processing capabilities, making it suitable for a wide range of applications.
  • Package

    The XC3SD1800A-4CSG484I chip has a BGA (Ball Grid Array) package type, a 484-pin package form, and a size of 17mm x 17mm.

Datasheet PDF

Preliminary Specification XC3SD1800A-4CSG484I PDF Download

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