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$5000Xilinx XC3S5000-5FGG900C
Spartan®-3 Field Programmable Gate Array (FPGA) IC 633 1916928 74880 900-BBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S5000-5FGG900C
Datasheet: XC3S5000-5FGG900C Datasheet (PDF)
Package/Case: BGA-900
RoHS Status:
Stock Condition: 3,053 pcs, New Original
Product Type: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
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1 | $1326.913 | $1326.913 |
189 | $529.447 | $100065.483 |
513 | $511.754 | $262529.802 |
999 | $503.014 | $502510.986 |
In Stock: 3,053 PCS
XC3S5000-5FGG900C General Description
Spartan®-3 Field Programmable Gate Array (FPGA) IC 633 1916928 74880 900-BBGA
Features
- 5 million system gates
- 1,152 I/O pins
- 500 MHz maximum operating frequency
- 900-pin FGG package
- 90nm process technology
Application
- High-speed data processing
- Digital signal processing
- High-speed networking
- Video and image processing
- Aerospace and defense systems
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Case/Package | FBGA | Mount | Surface Mount |
Number of Pins | 900 | Max Operating Temperature | 85 °C |
Min Operating Temperature | 0 °C | Number of Gates | 5e+06 |
Number of I/Os | 633 | Number of Logic Blocks (LABs) | 8320 |
Number of Logic Elements/Cells | 74880 | Operating Supply Voltage | 1.2 V |
RAM Size | 234 kB |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC3S5000-5FGG900C chip is a field-programmable gate array (FPGA) that belongs to the Spartan-3 generation of Xilinx FPGAs. It has 5,000 slices, each of which contains four 6-input LUTs and eight flip-flops, making it suitable for complex digital designs. The chip operates at a maximum speed grade of -5 and comes in a 900-ball flip-chip grid array (FGG900C) package.
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Equivalent
The possible equivalent products of the XC3S5000-5FGG900C chip are: 1. XC3S500E-5FGG900C, 2. XC3S5000-5FG900C, 3. XC3S500E-5FG900C, 4. XC3S5000-5FG676C, 5. XC3S500E-5FG676C. These chips have similar specifications and can be considered as alternatives to the XC3S5000-5FGG900C. -
Features
XC3S5000-5FGG900C is a field-programmable gate array (FPGA) with 5 million system gates, 900 FBGA package, and a maximum speed grade of -5. It offers extensive connectivity options including Gigabit Ethernet, PCI Express, and DDR2 memory interfaces. It is suitable for applications requiring high-performance digital signal processing, embedded processing, and high-speed serial connectivity. -
Pinout
The XC3S5000-5FGG900C is an FPGA with a pin count of 900. It is manufactured by Xilinx. The specific functions of the pins can vary depending on the circuit design and configuration. -
Manufacturer
The XC3S5000-5FGG900C is manufactured by Xilinx, Inc. It is an American technology company that specializes in the development and production of programmable logic devices (PLDs) and associated software tools. Xilinx is known for its field-programmable gate array (FPGA) products which are widely used in various industries such as aerospace, automotive, telecommunications, and more. -
Application Field
The XC3S5000-5FGG900C is a field-programmable gate array (FPGA) that can be used in various application areas, including telecommunications, aerospace and defense, automotive, consumer electronics, and industrial automation. It provides high performance, flexibility, and scalability, making it suitable for a wide range of applications in these industries. -
Package
The XC3S5000-5FGG900C chip is a Field-Programmable Gate Array (FPGA) with a package type of Flip Chip Ball Grid Array (FC-BGA). It has a 900-ball grid array package with a form factor of 31mm x 31mm, making it a small and compact chip.
Datasheet PDF
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