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$5000Xilinx XC3S400-4FG456C
Spartan®-3 Field Programmable Gate Array (FPGA) IC 264 294912 8064 456-BBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S400-4FG456C
Datasheet: XC3S400-4FG456C Datasheet (PDF)
Package/Case: BGA
RoHS Status:
Stock Condition: 2,412 pcs, New Original
Product Type: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $148.622 | $148.622 |
200 | $57.515 | $11503.000 |
500 | $55.494 | $27747.000 |
1000 | $54.494 | $54494.000 |
In Stock: 2,412 PCS
XC3S400-4FG456C General Description
Spartan®-3 Field Programmable Gate Array (FPGA) IC 264 294912 8064 456-BBGA
Features
- 400K system gates
- 488 user I/Os
- 36Kb block RAM
- 216 DSP slices
- Configurable Logic Blocks (CLBs) with dual 4-input lookup tables (LUTs)
- Advanced power management features
- Built-in system-level blocks for enhanced functionality
Application
- Aerospace and Defense: Used in radar systems, mission-critical avionics, and other high-reliability applications.
- Automotive: Used for advanced driver assistance systems (ADAS), infotainment systems, and other automotive applications.
- Industrial: Used in factory automation, control systems, and other industrial applications.
- Medical: Used in medical imaging systems, patient monitoring, and other medical equipment.
- Communications: Used in wired and wireless networking equipment, cellular base stations, and other communication systems.
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
Series: | XC3S400 | Number of Logic Elements: | 8064 LE |
Adaptive Logic Modules - ALMs: | 3584 ALM | Embedded Memory: | 288 kbit |
Number of I/Os: | 264 I/O | Supply Voltage - Min: | 1.14 V |
Supply Voltage - Max: | 1.26 V | Minimum Operating Temperature: | 0 C |
Maximum Operating Temperature: | + 85 C | Data Rate: | - |
Number of Transceivers: | - | Mounting Style: | SMD/SMT |
Package / Case: | FBGA-456 | Brand: | Xilinx |
Distributed RAM: | 56 kbit | Embedded Block RAM - EBR: | 288 kbit |
Maximum Operating Frequency: | 280 MHz | Moisture Sensitive: | Yes |
Number of Gates: | 400000 | Operating Supply Voltage: | 1.2 V |
Product Type: | FPGA - Field Programmable Gate Array | Factory Pack Quantity: | 1 |
Subcategory: | Programmable Logic ICs | Tradename: | Spartan |
Unit Weight: | 0.642339 oz |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S400-4FG456C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : Cyclone III EP3C40F484C8N
Brands :
Package :
Description : Cyclone III EP3C40F484C8N
Part points
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The XC3S400-4FG456C chip is a Field-Programmable Gate Array (FPGA) produced by Xilinx. It features 400K system gates and is manufactured using a 90nm process technology. The chip is designed to provide programmable logic functions and high-performance processing capabilities for a wide range of applications, including telecommunications, video processing, and industrial control systems.
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Equivalent
Equivalent products of the XC3S400-4FG456C chip are the XC3S400-4PQ208C, XC3S400-4TQG144C, and XC3S400-4FTG256C. -
Features
The XC3S400-4FG456C is an FPGA device that features 400K system gates, 1,620 slice flip-flops, 18,432 logic cells, and 166 user I/Os. It operates at a maximum speed of 550 MHz and is designed for applications in the fields of automotive, consumer electronics, telecommunications, and more. -
Pinout
The XC3S400-4FG456C is an FPGA (Field Programmable Gate Array) with a pin count of 456. It offers programmable logic cells, block RAM, and DSP slices, making it suitable for various applications, such as data processing and control systems. -
Manufacturer
The XC3S400-4FG456C is manufactured by Xilinx, Inc. Xilinx is a multinational technology company specialized in the design and creation of programmable logic devices, particularly field-programmable gate arrays (FPGAs). They provide solutions for various industries, including aerospace, defense, automotive, telecommunications, and more. -
Application Field
The XC3S400-4FG456C is a field-programmable gate array (FPGA) that can be used in a variety of applications such as aerospace and defense systems, automotive electronics, industrial automation, communications equipment, and medical devices. It offers high-performance logic, memory, and I/O capabilities, making it suitable for a wide range of embedded system designs. -
Package
The package type of the XC3S400-4FG456C chip is FG456. The form of the chip is BGA. The size of the chip is 17 mm x 17 mm.
Datasheet PDF
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