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Xilinx XC3S2000-4FG676I
Spartan®-3 Field Programmable Gate Array (FPGA) IC 489 737280 46080 676-BGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S2000-4FG676I
Datasheet: XC3S2000-4FG676I Datasheet (PDF)
Package/Case: BGA676
RoHS Status:
Stock Condition: 3,821 pcs, New Original
Product Type: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $272.650 | $272.650 |
| 200 | $105.513 | $21102.600 |
| 500 | $101.804 | $50902.000 |
| 1000 | $99.972 | $99972.000 |
In Stock: 3,821 PCS
XC3S2000-4FG676I General Description
Spartan®-3 Field Programmable Gate Array (FPGA) IC 489 737280 46080 676-BGA
Features
- 2,000,000 system gates
- 1,296 I/O pins
- 64 MB of embedded RAM
- Power consumption of 3.4 W (typical)
Application
- Aerospace and defense
- Automotive
- Consumer electronics
- Industrial control
- Medical equipment
- Telecommunications
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Case/Package | FBGA | Max Operating Temperature | 100 °C |
| Min Operating Temperature | -40 °C | Operating Supply Voltage | 1.2 V |
| RAM Size | 90 kB |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S2000-4FG676I component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC3S2000-4FGG676I
Brands :
Package : FBGA676
Description : FPGA Spartan®-3 Family 2M Gates 46080 Cells 630MHz 90nm Technology 1.2V
Part Number : XC3S2000-4FG900I
Brands :
Package : 900-BBGA
Description : 2000000 SYSTEM GATE 1.2 VOLT FPGA
Part Number : XC3S2000-4FGG900I
Brands :
Package : BGA-900
Description : Spartan-3 FPGA 565 I/O 900FBGA
Part Number : XC3S2000-4FGG320C
Brands :
Package :
Description :
Part points
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The XC3S2000-4FG676I is a Field-Programmable Gate Array (FPGA) integrated circuit manufactured by Xilinx. It is known for its high capacity, with 2 million system gates, and is built on a 90nm process technology. The chip offers low power consumption, high-speed performance, and various features like embedded multipliers and block RAM. It is commonly used in applications that require programmable logic and digital signal processing capabilities.
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Equivalent
Some equivalent products of the XC3S2000-4FG676I chip are the XC3S2000-4FGG676I and the XC3S2000-4FGG676C, both from Xilinx. -
Features
The XC3S2000-4FG676I is an FPGA (Field Programmable Gate Array) with 2 million system gates and 43200 logic cells. It has 592kb of RAM, supports high-speed serial connectivity, and offers up to 847 I/O pins. It operates at a maximum frequency of 400MHz, making it suitable for a wide range of applications. -
Pinout
The XC3S2000-4FG676I is an FPGA with a pin count of 676. It is designed for high-performance applications and features a combination of logic cells, RAM, and I/O resources. The exact pin functions can be found in the device datasheet provided by the manufacturer. -
Manufacturer
The manufacturer of the XC3S2000-4FG676I is Xilinx Inc. Xilinx is a technology company specializing in the design and manufacture of highly flexible and customizable field-programmable gate arrays (FPGAs), as well as associated development software and hardware. FPGAs are integrated circuits that can be programmed to perform specific functions, offering versatility and adaptability in various applications. -
Application Field
The XC3S2000-4FG676I is commonly used in applications such as telecommunications, networking, high-performance computing, automotive, and industrial control systems. -
Package
The XC3S2000-4FG676I chip is a Field-Programmable Gate Array (FPGA) that comes in a 676-pin Fine-Pitch Ball-Grid Array (FBGA) package. Its size is not explicitly mentioned but can be determined from the package type, indicating a grid of balls on the bottom surface of the chip for electrical connections.
Datasheet PDF
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