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$5000Xilinx XC3S1600E-5FGG484C
Spartan®-3E Field Programmable Gate Array (FPGA) IC 376 663552 33192 484-BBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S1600E-5FGG484C
Datasheet: XC3S1600E-5FGG484C Datasheet (PDF)
Package/Case: BGA-484
RoHS Status:
Stock Condition: 3,341 pcs, New Original
Product Type: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
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1 | $356.472 | $356.472 |
200 | $137.950 | $27590.000 |
500 | $133.102 | $66551.000 |
1000 | $130.708 | $130708.000 |
In Stock: 3,341 PCS
XC3S1600E-5FGG484C General Description
Spartan®-3E Field Programmable Gate Array (FPGA) IC 376 663552 33192 484-BBGA
Features
"XC3S1600E": This refers to the specific FPGA family and model. In this case, it belongs to the Xilinx Spartan-3E family, with a capacity of 1600 logic cells.
"5FGG484C": This describes the FPGA's package type and pin count. In this case, it has a Fine-Pitch Ball Grid Array (FBGA) package with 484 pins.
Application
- 1600 logic cells, which are programmable building blocks that can be configured to implement digital logic functions.
- 56 kilobits (KB) of distributed RAM and 16 multipliers for digital signal processing (DSP) applications.
- Support for various I/O standards, such as LVCMOS, LVTTL, and LVDS, making it suitable for interfacing with different types of devices.
- Built-in configuration memory for storing the FPGA configuration bitstream, which defines the desired logic functions and connections.
- JTAG programming interface for configuring the FPGA during development.
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
RoHS: | Details | Series: | XC3S1600E |
Number of Logic Elements: | 33192 LE | Number of I/Os: | 376 I/O |
Supply Voltage - Min: | 1.2 V | Supply Voltage - Max: | 1.2 V |
Minimum Operating Temperature: | 0 C | Maximum Operating Temperature: | + 85 C |
Data Rate: | 333 Mb/s | Mounting Style: | SMD/SMT |
Package / Case: | FCBGA-484 | Brand: | Xilinx |
Distributed RAM: | 231 kbit | Embedded Block RAM - EBR: | 648 kbit |
Maximum Operating Frequency: | 300 MHz | Moisture Sensitive: | Yes |
Number of Gates: | 1600000 | Operating Supply Voltage: | 1.2 V |
Product Type: | FPGA - Field Programmable Gate Array | Factory Pack Quantity: | 1 |
Subcategory: | Programmable Logic ICs |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S1600E-5FGG484C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : Embedded
Brands :
Package :
Description : systems: It can be used in various embedded systems applications, such as industrial automation, robotics, and automotive electronics.
Part Number : Communication
Brands :
Package :
Description : systems: It can be used for implementing protocols and interfaces for communication systems, such as Ethernet, USB, and UART.
Part Number : Test
Brands :
Package :
Description : and measurement: It can be used in test and measurement equipment for prototyping and validating digital circuits.
Part points
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The XC3S1600E-5FGG484C chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It has 1,600,000 system gates, is compatible with the 1.2V voltage standard, and operates at a speed grade of -5. The chip comes in a 484-ball, fine-pitch ball grid array (FBGA) package and offers a wide range of features and capabilities for digital circuit design and implementation.
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Equivalent
Some equivalent products of the XC3S1600E-5FGG484C chip are: XC3S1600E-4FGG484C, XC3S1600E-5FGG484, and XC3S1600E-4TTG484C. -
Features
The XC3S1600E-5FGG484C is a field-programmable gate array (FPGA) with 1,600K logic cells, support for multiple I/O standards, and a high-speed serial interface. It operates at a maximum frequency of 500MHz and has 48,128 logic slices. It also supports advanced features such as embedded block RAM and DSP slices for high-performance applications. -
Pinout
The XC3S1600E-5FGG484C is an FPGA device with 484 pins. It belongs to the Spartan-3E family and has 1,600 slices, which can be used to implement various functions and logic circuits, making it suitable for a wide range of applications. -
Manufacturer
The manufacturer of the XC3S1600E-5FGG484C is Xilinx. It is a multinational technology company that specializes in the design, development, and manufacturing of programmable logic devices (PLDs) and associated software. -
Application Field
The XC3S1600E-5FGG484C is a field-programmable gate array (FPGA) that can be used in a wide range of applications including telecommunications, data processing, automotive, defense, and industrial automation. It offers high-speed data processing, flexibility, and low power consumption, making it suitable for various complex and demanding applications. -
Package
The XC3S1600E-5FGG484C chip is a 484-pin Fine-Pitch Ball Grid Array (FBGA) package type. It has 484 solder ball contacts on the bottom surface. The chip has a size of approximately 23mm x 23mm.
Datasheet PDF
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