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Xilinx XC2S100E-6FTG256C

Spartan®-IIE Field Programmable Gate Array (FPGA) IC 182 40960 2700 256-LBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC2S100E-6FTG256C

Datasheet: XC2S100E-6FTG256C Datasheet (PDF)

Package/Case: BGA-256

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 2,927 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XC2S100E-6FTG256C or email to us: Email: [email protected], we will contact you within 12 hours.

XC2S100E-6FTG256C General Description

Spartan®-IIE Field Programmable Gate Array (FPGA) IC 182 40960 2700 256-LBGA

xc2s100e-6ftg256c

Features

  • XC2S100E-6FTG256C has a maximum gate count of 100,000 and is based on a 0.18μm CMOS process.
  • It has 2.5V to 3.3V power supply voltage, and 256-pin Fine-Pitch Ball-Grid Array (FBGA) packaging.
  • It also features up to 316 user I/Os and up to 92 differential signal pairs.

Application

  • XC2S100E-6FTG256C can be used in a wide range of applications, including digital signal processing, communication, multimedia, aerospace, defense, automotive, and industrial control.
  • It is suitable for high-performance and low-power applications, especially those requiring high-speed and parallel data processing.
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Mount Surface Mount Number of Pins 256
Max Operating Temperature 85 °C Min Operating Temperature 0 °C
Number of Gates 100000 Number of I/Os 182
Number of Logic Blocks (LABs) 600 Number of Logic Elements/Cells 2700
Operating Supply Voltage 1.8 V Packaging Bulk
RAM Size 5 kB

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC2S100E-6FTG256C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC2S100E-6FT256C

Brands :  

Package :   BGA256

Description :   Spartan-IIE 1.8V FPGA Family

Part Number :   XC2S100-6FG256C

Brands :  

Package :   256-BGA

Description :   100000 SYSTEM GATE 2.5 VOLT LOGIC CELL A - NOT RECOMMENDED for NEW DESIGN

Part Number :   XC2S100E-6FG256C

Brands :  

Package :  

Description :  

Part Number :   XC2S100-6FT256C

Brands :  

Package :  

Description :  

Part points

  • XC2S100E-6FTG256C is an FPGA (Field-Programmable Gate Array) chip manufactured by Xilinx. It belongs to the Spartan-II family and has a capacity of 100,000 system gates. It features 6ns Tpd (Propagation Delay) and comes in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. The chip allows for flexible and customizable digital circuit designs, making it suitable for various applications in fields like telecommunications, automotive, and aerospace.
  • Equivalent

    Some equivalent products of the XC2S100E-6FTG256C chip are XC2S100E-6TQG144C, XC2S100E-6PQG208C, XC2S100E-7FTG256C, XC2S100E-6PQG208I, and XC2S100E-6PQG208.
  • Features

    The XC2S100E-6FTG256C is a field-programmable gate array (FPGA) with 100,000 system gates, 2,520 logic cells, and 144 I/O pins. It operates on a 1.2V core voltage and offers 6ns maximum pin-to-pin delay. The device is housed in a 256-pin fine pitch Ball Grid Array (BGA) package.
  • Pinout

    The XC2S100E-6FTG256C is an FPGA (Field-Programmable Gate Array) device with a pin count of 256. It is a high-speed, low-power device that can be programmed to perform various logic functions and tasks based on the user's requirements.
  • Manufacturer

    The manufacturer of the XC2S100E-6FTG256C is Xilinx Inc. Xilinx is an American technology company that designs and manufactures programmable logic devices (PLDs) and related development software. They are known for their advanced semiconductor products that enable customers to create highly flexible and customizable integrated circuits for various applications in industries such as aerospace, automotive, telecommunications, and more.
  • Application Field

    The XC2S100E-6FTG256C is an electronic component known as a field-programmable gate array (FPGA). It can be applied in various areas such as telecommunications, automotive, aerospace, and defense industries. Its versatility allows it to be used in applications requiring high-speed processing, signal processing, and control functions.
  • Package

    The XC2S100E-6FTG256C chip is housed in a fine pitch ball grid array (BGA) package type. It has a 256-pin chip layout and a 6x6 mm size.

Datasheet PDF

Preliminary Specification XC2S100E-6FTG256C PDF Download

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