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Intel NHPXA270C5C520
RISC Microprocessor, 32-Bit, 520MHz, CMOS, PBGA360, 23 X 23 MM, 2.4 MM PITCH, PLASTIC, LEAD FREE, BGA-360
Brands: INTEL CORP
Mfr.Part #: NHPXA270C5C520
Datasheet: NHPXA270C5C520 Datasheet (PDF)
Package/Case: BGA-356
NHPXA270C5C520 General Description
RISC Microprocessor, 32-Bit, 520MHz, CMOS, PBGA360, 23 X 23 MM, 2.4 MM PITCH, PLASTIC, LEAD FREE, BGA-360
Features
- High-performance processor:—Intel XScale® microarchitecture with Intel® Wireless MMX™ Technology—7 Stage pipeline—32 KB instruction cache—32 KB data cache—2 KB “mini” data cache—Extensive data buffering 256 Kbytes of internal SRAM for high speed code or data storage preserved during low-power states High-speed baseband processor interface (Mobile Scalable Link) Rich serial peripheral set:—AC’97 audio port—I2S audio port—USB Client controller—USB Host controller—USB On-The-Go controller—Three high-speed UARTs (two with hardware flow control) Hardware debug features — IEEE JTAG interface with boundary scan Hardware performance-monitoring features with on-chip trace buffer Real-time clock Operating-system timers LCD Controller Universal Subscriber Identity Module interface Low power:—Wireless Intel Speedstep® Technology—Less than 500 mW typical internal dissipation—Supply voltage may be reduced to 0.85 V—Four low-power modes—Dynamic voltage and frequency management High-performance memory controller:—Four banks of SDRAM: up to 104 MHz @ 2.5V, 3.0V, and 3.3V I/O interface—Six static chip selects—Support for PCMCIA and Compact Flash—Companion chip interface Flexible clocking:—CPU clock from 104 to 624 MHz—Flexible memory clock ratios—Frequency changes—Functional clock gating Additional peripherals for system connectivity:—SD Card / MMC Controller (with SPI mode support)—Memory Stick card controller—Three SSP controllers—Two I2C controllers—Four pulse-width modulators (PWMs)—Keypad interface with both direct and matrix keys support—Most peripheral pins double as GPIOs
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Rohs Code | Yes | Part Life Cycle Code | Transferred |
| Ihs Manufacturer | INTEL CORP | Part Package Code | BGA |
| Package Description | BGA, | Pin Count | 360 |
| Reach Compliance Code | compliant | HTS Code | 8542.31.00.01 |
| Address Bus Width | 26 | Bit Size | 32 |
| Boundary Scan | YES | Clock Frequency-Max | 3.6864 MHz |
| External Data Bus Width | 32 | Format | FIXED POINT |
| Integrated Cache | YES | JESD-30 Code | S-PBGA-B360 |
| JESD-609 Code | e1 | Low Power Mode | YES |
| Number of Terminals | 360 | Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA | Package Shape | SQUARE |
| Package Style | GRID ARRAY | Qualification Status | Not Qualified |
| Speed | 520 MHz | Supply Voltage-Max | 1.595 V |
| Supply Voltage-Min | 1.3775 V | Supply Voltage-Nom | 1.45 V |
| Surface Mount | YES | Technology | CMOS |
| Terminal Finish | TIN SILVER COPPER | Terminal Form | BALL |
| Terminal Position | BOTTOM |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The NHPXA270C5C520 chip is a powerful and efficient system-on-chip (SoC) designed by NXP Semiconductors. It features a PXA270 processor core running at 520 MHz, along with various integrated peripherals such as LCD controller, Ethernet, USB, and UART. This chip is commonly used in embedded applications requiring high performance and low power consumption.
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Equivalent
The equivalent products of NHPXA270C5C520 chip are Intel PXA270, Marvell PXA270, Qualcomm MSM7201A, and Freescale i.MX31. These chips are similar in terms of performance and features, offering a range of options for various electronic devices and applications. -
Features
- PXA270 processor - Clock speed 520MHz - 32-bit architecture - Integrated memory controller - Low-power consumption - Wide range of operating systems support - Multiple connectivity options - Scalable and flexible design - Ideal for embedded systems and mobile devices -
Pinout
The NHPXA270C5C520 has 520 pins. It is a 32-bit microprocessor from Intel's PXA27x family, designed for embedded systems. It features a StrongARM core running at up to 520 MHz and specialized functions for multimedia, connectivity, and power management. -
Manufacturer
The NHPXA270C5C520 processor is manufactured by NXP Semiconductors. NXP Semiconductors is a Dutch-American semiconductor manufacturer that specializes in secure connectivity solutions for embedded applications in automotive, industrial, and consumer markets. -
Application Field
The NHPXA270C5C520 processor is commonly used in embedded applications such as industrial automation, POS terminals, medical devices, and network appliances. It offers high-performance processing capabilities, low power consumption, and versatile connectivity options, making it suitable for a wide range of embedded systems that require reliable and robust performance. -
Package
The NHPXA270C5C520 chip comes in a 520-ball BGA (Ball Grid Array) package, with dimensions of 17mm x 17mm.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products
