XCZU5EG-1SFVC784I

Part points

• The XCZU5EG-1SFVC784I chip is a member of the Xilinx Zynq UltraScale+ family, offering a powerful combination of programmable logic and processing capabilities. It features a quad-core ARM Cortex-A53 processor, two ARM Cortex-R5 processors, Mali-400 MP2 GPU, and programmable logic for custom accelerators. This chip is ideal for a wide range of applications requiring high processing performance and flexibility.

• Equivalent

  Some equivalent products of XCZU5EG-1SFVC784I chip include XCZU5EG-1SFVC784 chip, XCZU5CG-1SFVC784I chip, and XCZU5CG-1SFVC784 chip. These chips are part of the Xilinx Zynq UltraScale+ family with similar specifications and capabilities.

• Features

  Some features of XCZU5EG-1SFVC784I include a Xilinx UltraScale+ architecture, integrated Arm Cortex-A53 processors, programmable logic cells, DSP slices, 10 Gb/s Ethernet connectivity, PCIe Gen3 interface, and high-speed transceivers. It also has 784K logic cells, 2500 DSP slices, and 40.5Mb of ultra RAM.

• Pinout

  The XCZU5EG-1SFVC784I is a Zynq UltraScale+ MPSoC with 784 pins. It is a high-performance, highly integrated device that combines a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processing unit, and a Mali-400 MP graphics processing unit with programmable logic in a single chip for various applications.

• Manufacturer

  XCZU5EG-1SFVC784I is manufactured by Xilinx, which is an American technology company specializing in the development of programmable devices and related technologies. Xilinx is a leading provider of field-programmable gate arrays (FPGAs), SoCs, and other semiconductor products used in a wide range of applications such as data centers, 5G wireless, automotive, and aerospace.

• Application Field

  The XCZU5EG-1SFVC784I is a highly versatile system-on-chip device that can be used in a wide range of applications such as automotive, aerospace, industrial automation, and telecommunications. It can be used for tasks such as image processing, artificial intelligence, data analytics, and signal processing.

• Package

  The XCZU5EG-1SFVC784I chip is a System on Chip (SoC) in a flip-chip Ball Grid Array (BGA) package. It has a form factor of 784-pin and a size of 29mm x 29mm.