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JS28F256P33TFE

NOR Flash PARALLEL NOR MLC 16MX16 TSOP

ISO14001 ISO9001 DUNS

Brands: micron technology

Mfr.Part #: JS28F256P33TFE

Datasheet: JS28F256P33TFE Datasheet (PDF)

Package/Case: TSOP-56

RoHS Status:

Stock Condition: 7860 pcs, New Original

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Quick Quote

Please submit RFQ for JS28F256P33TFE or email to us: Email: [email protected], we will contact you within 12 hours.

JS28F256P33TFE

Features

  • High performance
  • — 85/88 ns initial access
  • — 40 MHz with zero wait states, 20 ns clock-to data output synchronous-burst read mode
  • — 25 ns asynchronous-page read mode
  • — 4-, 8-, 16-, and continuous-word burst mode
  • — Buffered Enhanced Factory Programming (BEFP) at 5 µs/byte (Typ)
  • — 1.8 V buffered programming at 7 µs/byte (Typ)
  • Architecture
  • — Multi-Level Cell Technology: Highest Density at Lowest Cost
  • — Asymmetrically-blocked architecture
  • — Four 32-KByte parameter blocks: top or bottom configuration
  • — 128-KByte main blocks
  • Voltage and Power
  • —VCC(core) voltage: 1.7 V – 2.0 V
  • —VCCQ (I/O) voltage: 1.7 V – 3.6 V
  • — Standby current: 55 µA (Typ) for 256-Mbit
  • — 4-Word synchronous read current: 13 mA (Typ) at 40 MHz
  • Quality and Reliability
  • — Operating temperature: –40 °C to +85 °C
  • 1-Gbit in SCSP is –30 °C to +85 °C
  • — Minimum 100,000 erase cycles per block
  • — ETOX™ VIII process technology (130 nm)
  • Security
  • — One-Time Programmable Registers:
  • 64 unique factory device identifier bits
  • 64 user-programmable OTP bits
  • Additional 2048 user-programmable OTP bits
  • — Selectable OTP Space in Main Array:
  • 4x32KB parameter blocks + 3x128KB main blocks (top or bottom configuration)
  • — Absolute write protection: VPP= VSS
  • — Power-transition erase/program lockout
  • — Individual zero-latency block locking
  • — Individual block lock-down
  • Software
  • — 20 µs (Typ) program suspend
  • — 20 µs (Typ) erase suspend
  • —Intel® Flash Data Integrator optimized
  • — Basic Command Set and Extended Command Set compatible
  • — Common Flash Interface capable
  • Density and Packaging
  • — 64/128/256-Mbit densities in 56-Lead TSOP package
  • — 64/128/256/512-Mbit densities in 64-Ball Intel®Easy BGA package
  • — 64/128/256/512-Mbit and 1-Gbit densities in Intel®QUAD+ SCSP
  • — 16-bit wide data bus

Specifications

Parameter Value Parameter Value
Product Category NOR Flash Mounting Style SMD/SMT
Package / Case TSOP-56 Series P33
Memory Size 256 Mbit Supply Voltage - Min 2.3 V
Supply Voltage - Max 3.6 V Active Read Current - Max 50 mA
Interface Type Parallel Maximum Clock Frequency 40 MHz
Organization 16 M x 16 Data Bus Width 16 bit
Timing Type Asynchronous, Synchronous Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 85 C Brand Micron
Memory Type NOR Product Type NOR Flash
Speed 105 ns Standard Common Flash Interface (CFI)
Factory Pack Quantity 576 Subcategory Memory & Data Storage
Type Boot Block

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The JS28F256P33TFE is a flash memory chip manufactured by Intel. It offers a storage capacity of 256 MB and uses NOR flash technology. The chip is commonly used in devices like routers, modems, and embedded systems. Its fast access times and high endurance make it suitable for applications that require reliable and efficient data storage.
  • Equivalent

    There isn't an exact equivalent for the JS28F256P33TFE chip, as it is a specific model. However, there are similar flash memory chips available from other manufacturers such as Micron, Samsung, or Toshiba. These chips may have different part numbers but offer similar capacities and functionality.
  • Features

    The JS28F256P33TFE is a 256Mb (32MB) NOR flash memory device. It offers high-performance read and write operations, features a fast erase capability, and has a low power consumption. It operates in a voltage range of 2.7V to 3.6V, with a clock frequency of up to 100MHz.
  • Pinout

    The JS28F256P33TFE is a NOR flash memory chip. It has a 48-pin count, and its function is to store and retrieve data electronically. The specific pin functions may vary depending on the package and manufacturer, but typically include power supply, data input/output, address input, and control signals.
  • Manufacturer

    The JS28F256P33TFE is manufactured by Intel Corporation, which is a multinational technology company. Intel specializes in designing and producing computer processors, motherboard chipsets, flash memory, and other related products for the personal computer and server market.
  • Application Field

    The JS28F256P33TFE is commonly used in embedded systems and devices that require high-density non-volatile memory for storing data or code. It is well-suited for applications such as automotive systems, industrial control systems, gaming consoles, medical equipment, and networking devices.
  • Package

    The JS28F256P33TFE chip comes in a TSOP package type, with a form called TSOP-I, and it has a size of 8mm x 14mm.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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