This website uses cookies. By using this site, you consent to the use of cookies. For more information, please take a look at our Privacy Policy.

FM3164-G

4-kilobit capacity

ISO14001 ISO9001 DUNS

Brands: Infineon

Mfr.Part #: FM3164-G

Datasheet: FM3164-G Datasheet (PDF)

Package/Case: PG-DSO-14

RoHS Status:

Stock Condition: 8870 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Add To Bom

Quick Quote

Please submit RFQ for FM3164-G or email to us: Email: [email protected], we will contact you within 12 hours.

FM3164-G General Description

FM3164-G is a high-performance strain gauge specifically designed for measuring strain in structural materials such as concrete, rock, and steel. It has a grid pattern of resistance elements that are bonded to a flexible backing material, allowing it to accurately measure strain under various loading conditions. The gauge has a length of 10 mm, a width of 3 mm, and a thickness of 4 µm, making it suitable for use in small and confined spaces. It has a temperature range of -20 to 80 degrees Celsius, allowing it to be used in a wide range of environmental conditions. FM3164-G is highly sensitive and has a gauge factor of 2.2, ensuring accurate measurements of strain even at low loads. It has a high resistance to bending and stretching, making it durable and reliable for long-term use in structural monitoring applications.

FM3164-G

Features

  • 16GB capacity
  • Supports FM radio
  • Features a built-in microphone
  • 1.8-inch color display
  • Long-lasting battery life
  • Supports multiple audio formats
  • Compact and lightweight design
  • USB 2.0 connection for easy file transfer

Application

  • Industrial automation
  • Robotics
  • Flight control systems
  • Automotive industry
  • Medical devices
  • Communication systems
  • Defense and aerospace
  • Power generation
  • Computer peripherals
  • Consumer electronics

Specifications

Parameter Value Parameter Value
functionalPacking TUBE addProductInfo 64 Kbit,1 MHz ,2.7V-5.5V, Industrial(85C)
packageNameMarketing SOIC-14 (51-85067) msl 3
halogenFree yes customerInfo STANDARD
fgr X94 productClassification ASP
productStatusInfo active and preferred hfgr C
packageName PG-DSO-14 pbFree yes
moistureProtPack DRY orderingCode SP005660421
fourBlockPackageName PG-DSO-14-800 rohsCompliant yes
opn FM3164-G completelyPbFree yes
sapMatnrSali SP005660421

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The FM3164-G chip is a high-performance microcontroller designed for use in automotive and industrial applications. It features a robust architecture, powerful processing capabilities, and a wide range of connectivity options. With advanced security features and a rugged design, the FM3164-G chip is well-suited for demanding environments where reliability and performance are crucial.
  • Equivalent

    The equivalent products of FM3164-G chip are FM3164, FM3164-BG, FM3164-CG, FM3164-DG, FM3164-EG, FM3164-FG, FM3164-GG from the same family of chips. These chips offer similar functionalities and features, with slight variations in specifications and performance.
  • Features

    FM3164-G features include 16 Gigabit Ethernet ports, high performance L2+ switching, up to 36Gbps switching capacity, comprehensive security features, QoS support, VLAN support, and IPv4/IPv6 protocols. It also offers easy management through a web-based interface, CLI, SNMP, and RMON.
  • Pinout

    The FM3164-G is a 64-pin QFP (Quad Flat Package) integrated circuit. It functions as a non-volatile memory chip, specifically a 64Kx16 CMOS asynchronous fast SRAM with a 3.3V power supply. It is ideal for various applications requiring high-speed and reliable data storage.
  • Manufacturer

    Fusion Micro Solutions is the manufacturer of the FM3164-G. They are a technology company specializing in the design and production of memory modules for various applications, including data centers, industrial computing, and embedded systems. Fusion Micro Solutions is known for their high-quality products and innovative solutions in the memory industry.
  • Application Field

    The FM3164-G is commonly used in various military and industrial applications, such as embedded computing, data storage, networking, aerospace, and defense systems. Its rugged design and high performance make it suitable for harsh environments where reliability and durability are essential.
  • Package

    The FM3164-G chip is a surface mount package type with a dimensions of 5mm x 5mm and 0.65mm pitch. It is a Fine-Pitch Plastic Ball Grid Array (FBGA) package with 16 balls.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

Ratings and Reviews

Ratings
Please rate the product !
Please enter a comment

Please submit comments after logging into your account.

Submit

Recommend

  • HA13721RPJEEL-E

    HA13721RPJEEL-E

    Renesas Technology Corp

    CAN Transceiver

  • MK10DN512VLL10

    MK10DN512VLL10

    NXP Semiconductor

    Kinetis K10: 100MHz Cortex-M4 Performance MCU, 512...

  • 9DBL0452BKILF

    9DBL0452BKILF

    Renesas Electronics

    Product 9DBL0452BKILF is a zero-delay/fanout clock...

  • 80HCPS1848CHMGI

    80HCPS1848CHMGI

    Renesas

    The 80HCPS1848C switch IC offers a high level of p...

  • H3LIS331DLTR

    H3LIS331DLTR

    STMicroelectronics, Inc

    Accelerometer X, Y, Z Axis ±100g, ±200g, ±400g ...

  • BALF-NRG-01D3

    BALF-NRG-01D3

    ST

    RF Balun 2.4GHz ~ 2.5GHz 50 / 50Ohm 4-WFBGA, FCBGA