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Intel EP4CGX50CF23I7N
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 290 2562048 49888 484-BGA
Brands: Intel Corp
Mfr.Part #: EP4CGX50CF23I7N
Datasheet: EP4CGX50CF23I7N Datasheet (PDF)
Package/Case: FBGA-484
Product Type: Programmable Logic ICs
EP4CGX50CF23I7N General Description
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 290 2562048 49888 484-BGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pin Count | 484 | Package Category | BGA |
| Released Date | Mar 24, 2021 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The EP4CGX50CF23I7N chip is a field-programmable gate array (FPGA) produced by Intel. It belongs to the Cyclone IV GX series and offers 49,920 logic elements and 433,856 bits of embedded memory. The chip features high-speed transceivers, support for multiple I/O standards, and integrated hard IP blocks for enhanced performance. With its configurable nature and advanced features, it is widely used in various applications like telecommunications, industrial automation, and image processing.
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Equivalent
Some equivalent products of the EP4CGX50CF23I7N chip include Altera's Cyclone IV GX FPGA series with similar features and configurations, such as EP4CGX50CF23I7, EP4CGX50CF23C7, and EP4CGX50CF23I7N. These chips are widely used for their programmable logic, high-speed performance, and low power consumption capabilities. -
Features
EP4CGX50CF23I7N is a field-programmable gate array (FPGA) manufactured by Intel (formerly Altera). It has 49,152 logic elements and offers 50,592 adaptive logic modules. It operates on a 1.1V core supply voltage and supports various communication protocols such as Gigabit Ethernet and PCI Express. -
Pinout
The EP4CGX50CF23I7N is a programmable logic device with a pin count of 780. It features a variety of functions such as programmable input/output (IO) interfaces, on-chip memory, embedded multipliers, and high-speed serial transceivers. -
Manufacturer
Intel is the manufacturer of the EP4CGX50CF23I7N. It is an American multinational corporation specializing in designing and manufacturing semiconductor chips and other related technologies. -
Application Field
The EP4CGX50CF23I7N is a field-programmable gate array (FPGA) with various applications in industrial automation, automotive, telecommunications, and aerospace industries. It can be used for tasks such as implementing signal processing algorithms, control systems, high-speed data acquisition, image and video processing, and more. -
Package
The EP4CGX50CF23I7N chip comes in a FBGA (Fine-pitch Ball Grid Array) package with a form factor of 23x23 mm and a package size of 484-ball.
Datasheet PDF
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