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Intel EP4CGX22BF14C8N

FPGA Cyclone® IV GX Family 21280 Cells 60nm Technology 1.2V 169-Pin FBGA

ISO14001 ISO9001 DUNS

Brands: Intel Corp

Mfr.Part #: EP4CGX22BF14C8N

Datasheet: EP4CGX22BF14C8N Datasheet (PDF)

Package/Case: FBGA-169

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3609 pcs, New Original

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Quick Quote

Please submit RFQ for EP4CGX22BF14C8N or email to us: Email: [email protected], we will contact you within 12 hours.

EP4CGX22BF14C8N General Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 774144 21280 169-LBGA

Intel Corp Inventory

Specifications

Parameter Value Parameter Value
feature-family-name Cyclone® IV GX feature-process-technology 60nm
feature-maximum-number-of-user-i-os 72 feature-number-of-registers
feature-device-logic-cells 21280 feature-device-system-gates
feature-number-of-multipliers 40 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 756 feature-total-number-of-block-ram 84
feature-ethernet-macs feature-supported-ip-core ISA/PC Card/PCMCIA/Compact Flash Host Adapter|PCI Express to AXI Bridge Controller (GPEX-PAB)|Sub-frame Latency JPEG 2000 Encoder (BA130)|Viterbi Compiler, Low-Speed/Hybrid Serial Decoder
feature-supported-ip-core-manufacture Altera/CAST, Inc/Barco Silex/Mobiveil, Inc/Eureka Technology Inc feature-maximum-number-of-serdes-channels
feature-device-logic-units 21280 feature-device-number-of-dlls-plls 2
feature-transceiver-blocks 4 feature-transceiver-speed-gbps 2.5
feature-dedicated-dsp feature-pci-blocks 1
feature-programmability Yes feature-maximum-internal-frequency-mhz
feature-speed-grade 8 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported SSTL|RSDS|LVDS|LVPECL|HSTL|B-LVDS feature-single-ended-i-o-standards-supported HSTL|SSTL|PCI-X|PCI|LVCMOS|LVTTL
feature-external-memory-interface QDRII+SRAM|DDR2 SDRAM feature-minimum-operating-supply-voltage-v 1.16
feature-maximum-operating-supply-voltage-v 1.24 feature-packaging
feature-rohs feature-rad-hard
feature-pin-count 169 feature-supplier-package FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code EAR99
feature-svhc No

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP4CGX22BF14C8N chip is a low-cost, low-power Field-Programmable Gate Array (FPGA) developed by Intel. It offers a compact, high-performance solution for various applications, including communications, industrial automation, and embedded systems. With 22,320 logic elements, 646KB embedded memory, and enhanced I/O capabilities, it provides flexibility and scalability for implementing complex digital designs. Additionally, it has efficient power management features, making it suitable for power-sensitive applications.
  • Equivalent

    Some equivalent products of the EP4CGX22BF14C8N chip are the EP4CGX15BF14C8N, EP4CGX22DF14C8N, and the EP4CGX30CF14C8N chips.
  • Features

    The EP4CGX22BF14C8N is an FPGA (Field Programmable Gate Array) chip from Intel. It has 22,320 logic elements, 622 user I/O pins, and 21 global clock networks. It operates at a speed of up to 500MHz and includes features such as embedded memory blocks, high-speed LVDS (Low-Voltage Differential Signaling) I/O, and a PLL (Phase-Locked Loop) for clock generation.
  • Pinout

    The EP4CGX22BF14C8N is an Altera Cyclone IV FPGA with a pin count of 484 pins. The pin functions can vary based on the design implemented on the FPGA but typically include I/O pins, clock pins, power pins, and configuration pins.
  • Manufacturer

    The manufacturer of the EP4CGX22BF14C8N is Intel. Intel is an American multinational corporation that specializes in the design and manufacturing of semiconductors, microprocessors, and other electronic components. They are one of the largest and most well-known manufacturers in the technology industry.
  • Application Field

    The EP4CGX22BF14C8N is a low-power, high-performance FPGA chip. Its application areas include telecommunications, automotive, industrial automation, and aerospace systems. It can be used for tasks such as data processing, signal processing, control systems, and image/video processing.
  • Package

    The EP4CGX22BF14C8N chip is packaged in a Field Programmable Gate Array (FPGA) with a Ball Grid Array (BGA) form. It has a size of 14mm x 14mm.

Datasheet PDF

Preliminary Specification EP4CGX22BF14C8N PDF Download

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  • quantity

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  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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