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Intel EP4CGX15BF14I7N

Field Programmable Gate Array, 900 CLBs, 472.5MHz, 14400-Cell, PBGA169

ISO14001 ISO9001 DUNS

Brands: Intel Corp

Mfr.Part #: EP4CGX15BF14I7N

Datasheet: EP4CGX15BF14I7N Datasheet (PDF)

Package/Case: FBGA-169

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3198 pcs, New Original

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EP4CGX15BF14I7N General Description

FPGA, CYCLONE IV GX, 15K, 169 FBGA; No. of Logic Blocks: 900; No. of Macrocells: 14400; FPGA Family: Cyclone IV; Logic Case Style: FBGA; No. of Pins: 169Pins; No. of Speed Grades: 7; Total RAM Bits: 540Kbit; No. of I/O's: 72I/O's; Clock Management: PLL; Core Supply Voltage Min: 1.16V; Core Supply Voltage Max: 1.24V; I/O Supply Voltage: 3.3V; Operating Frequency Max: 472.5MHz; Product Range: Cyclone IV Series; MSL: MSL 3 - 168 hours; SVHC: No SVHC (17-Dec-2015); Core Supply Voltage Range: 1.16V to 1.24V; Logic Function Number: FPGA; Operating Temperature Max: 100°C; Operating Temperature Min: -40°C; Operating Temperature Range: -40°C to +100°C

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Specifications

Parameter Value Parameter Value
feature-family-name Cyclone® IV GX feature-process-technology 60nm
feature-maximum-number-of-user-i-os 72 feature-number-of-registers
feature-device-logic-cells 14400 feature-device-system-gates
feature-number-of-multipliers feature-program-memory-type SRAM
feature-ram-bits-kbit 540 feature-total-number-of-block-ram 60
feature-ethernet-macs feature-supported-ip-core Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|Sub-frame Latency JPEG 2000 Encoder (BA130)|PCI Express to AXI Bridge Controller (GPEX-PAB)|ISA/PC Card/PCMCIA/Compact Flash Host Adapter
feature-supported-ip-core-manufacture Altera/CAST, Inc/Barco Silex/Mobiveil, Inc/Eureka Technology Inc feature-maximum-number-of-serdes-channels
feature-device-logic-units 14400 feature-device-number-of-dlls-plls 2
feature-transceiver-blocks 2 feature-transceiver-speed-gbps 2.5
feature-dedicated-dsp feature-pci-blocks 1
feature-programmability Yes feature-maximum-internal-frequency-mhz
feature-speed-grade 7 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL feature-single-ended-i-o-standards-supported LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL
feature-external-memory-interface DDR2 SDRAM|QDRII+SRAM feature-minimum-operating-supply-voltage-v 1.16
feature-maximum-operating-supply-voltage-v 1.24 feature-packaging
feature-rohs feature-rad-hard
feature-pin-count 169 feature-supplier-package FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code EAR99
feature-svhc Yes

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP4CGX15BF14I7N is a field-programmable gate array (FPGA) chip manufactured by Intel. It features 15,358 logic elements, 512 KB embedded memory, and 414 user I/Os. This chip is commonly used in applications such as telecommunications, industrial automation, and multimedia processing due to its high performance and flexibility.
  • Equivalent

    The equivalent products of EP4CGX15BF14I7N chip are EP4CGX15BF14C8N, EP4CGX15BF14C7N, EP4CGX15BF14C6N, and EP4CGX15BF14C5N. These chips are part of the Cyclone IV GX FPGA series and offer similar features and capabilities to the EP4CGX15BF14I7N chip.
  • Features

    EP4CGX15BF14I7N is a low-cost and low-power FPGA from Altera (now part of Intel). It features 15,008 logic elements, 7,680 Kbits of RAM, and 101 user I/Os. It also includes various IP cores for implementing functions like PLLs, DDR2 controllers, and flash memory interfaces.
  • Pinout

    The EP4CGX15BF14I7N is a 144-pin device with 112 user I/O pins, 5 global clock networks, and 2 PLLs. It is a low-cost FPGA with 15,360 logic elements, 588 Kbits of RAM, and 140 DSP blocks. It is ideal for a variety of applications including communications, video processing, and industrial control.
  • Manufacturer

    The EP4CGX15BF14I7N is manufactured by Intel. Intel is a multinational corporation that designs and manufactures computer processors, integrated circuits, and other hardware components. They are a leading technology company in the semiconductor industry, known for their innovation and high-performance products.
  • Application Field

    The EP4CGX15BF14I7N is commonly used in industrial automation, automotive, telecommunications, and consumer electronics. It is suitable for applications requiring high-speed data processing, networking, and encryption. Its low power consumption and high reliability make it ideal for use in a variety of embedded systems and digital signal processing applications.
  • Package

    The EP4CGX15BF14I7N chip is a BGA (Ball Grid Array) package type with a form factor of 14x14 mm and a size of 196-ball.

Datasheet PDF

Preliminary Specification EP4CGX15BF14I7N PDF Download

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