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Altera EP2AGX45DF29I3N

FPGA Arria® II GX Family 42959 Cells 500MHz 40nm Technology 0.9V 780-Pin FC-FBGA

ISO14001 ISO9001 DUNS

Brands: Altera Corporation (Intel)

Mfr.Part #: EP2AGX45DF29I3N

Datasheet: EP2AGX45DF29I3N Datasheet (PDF)

Package/Case: FBGA-780

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 2,091 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for EP2AGX45DF29I3N or email to us: Email: [email protected], we will contact you within 12 hours.

EP2AGX45DF29I3N General Description

Arria II GX Field Programmable Gate Array (FPGA) IC 364 3517440 42959 780-BBGA, FCBGA

Altera Corporation (Intel) Inventory

Specifications

Parameter Value Parameter Value
feature-family-name Arria® II GX feature-process-technology 40nm
feature-maximum-number-of-user-i-os 364 feature-number-of-registers
feature-device-logic-cells 42959 feature-device-system-gates
feature-number-of-multipliers 232 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 3435 feature-total-number-of-block-ram 319
feature-ethernet-macs 1 feature-supported-ip-core Video LVDS SerDes Transmitter / Receiver|10/100/1G Ethernet MACController (GMAC)|IP Compiler for PCI Express x8 (Soft IP)|10/100/1000Mbps Full Duplex Ethernet MAC|Hashing IP Core (BA413)
feature-supported-ip-core-manufacture Microtronix Inc/Mobiveil, Inc/CAST, Inc/Barco Silex/MorethanIP feature-maximum-number-of-serdes-channels 28
feature-device-logic-units 42959 feature-device-number-of-dlls-plls 4
feature-transceiver-blocks 8 feature-transceiver-speed-gbps 6.375
feature-dedicated-dsp 29 feature-pci-blocks 1
feature-programmability Yes feature-maximum-internal-frequency-mhz 500
feature-speed-grade 3 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12 feature-single-ended-i-o-standards-supported LVTTL|LVCMOS
feature-external-memory-interface DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|RLDRAM II|QDRII+SRAM feature-minimum-operating-supply-voltage-v 0.87
feature-maximum-operating-supply-voltage-v 0.93 feature-packaging
feature-rohs feature-rad-hard
feature-pin-count 780 feature-supplier-package FC-FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A991
feature-svhc

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP2AGX45DF29I3N is a field-programmable gate array (FPGA) chip from Altera. It features 45,000 logic elements, 1.51 Mb embedded memory, and 599 user I/Os. This chip is ideal for various applications, including telecommunications, networking, and industrial automation.
  • Equivalent

    Some equivalent products of the EP2AGX45DF29I3N chip are Xilinx XC2C256-TQ144, Altera EP2AGX45DF29C5N, and Lattice LG2-1200-3-1. These chips offer similar functionality and performance capabilities for designers seeking alternatives to the original chip.
  • Features

    1. FPGA with 45,408 logic elements 2. 1779 Kbits of embedded memory 3. Supports up to 408 LVDS channels 4. 29,312 adaptive logic modules 5. 37,937 embedded multipliers 6. Flexible I/O options with up to 352 user I/Os (Note: This information is based on publicly available datasheets and may vary depending on the specific configuration.)
  • Pinout

    The EP2AGX45DF29I3N is a 144-pin FPGA (Field Programmable Gate Array) device. It has various functions, such as customizable logic, memory blocks, and high-speed I/O interfaces, making it suitable for a wide range of applications in telecommunications, industrial control, and automotive industries.
  • Manufacturer

    The EP2AGX45DF29I3N is manufactured by Intel Corporation. It is a multinational technology company that designs and manufactures computer components, including semiconductors, processors, and other related devices. Intel is known for its innovation in the technology industry and is a leading supplier of integrated circuits worldwide.
  • Application Field

    The EP2AGX45DF29I3N, also known as the Altera Cyclone II FPGA, is commonly used in various applications such as industrial automation, telecommunications, audio/video processing, and electronic test equipment. It is also used in networking and data storage applications due to its low power consumption and high performance capabilities.
  • Package

    The EP2AGX45DF29I3N chip is a 896-pin flip-chip BGA package in the form of an integrated circuit. It has a size of 17mm x 17mm with a ball pitch of 0.8mm.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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