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TI WL1807MODGIMOCR
Multiprotocol Modules WL18xxMOD Dual-Band Ind Mod
Brands: Ti
Mfr.Part #: WL1807MODGIMOCR
Datasheet: WL1807MODGIMOCR Datasheet (PDF)
Package/Case: QFM100
Product Type: Combo Wireless Module
WL1807MODGIMOCR General Description
The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and Bluetooth® coexistence (WL1837MOD only) in a power-optimized design. The WL18x7MOD is a Wi-Fi, dual-band, 2.4- and 5-GHz module solution with two antennas supporting industrial temperature grade. The device is FCC, IC, ETSI/CE, and TELEC certified for AP (with DFS support) and client. TI offers drivers for high-level operating systems, such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.
Features
- General
- Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives, and power management
- Quick hardware design with TI module collateral and reference designs
- Operating temperature: –40°C to +85°C industrial temperature grade
- Small form factor: 13.3 × 13.4 × 2 mm
- 100-pin MOC package
- FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
- Wi-Fi
- WLAN baseband processor and RF transceiver support of IEEE Std 802.11a, 802.11b, 802.11g, and 802.11n
- 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
- 2.4-GHz MRC support for extended range and 5-GHz diversity capable
- Fully calibrated: production calibration not required
- 4-bit SDIO host interface support
- Wi-Fi direct concurrent operation (multichannel, multirole)
- Bluetooth and Bluetooth low energy ( WL1837MOD only)
- Bluetooth 5.1 secure connection compliant and CSA2 support (declaration ID: D052427 )
- Host controller interface (HCI) transport for Bluetooth over UART
- Dedicated audio processor support of SBC encoding + A2DP
- Dual-mode Bluetooth and Bluetooth low energy
- TI’s Bluetooth and Bluetooth low energy certified stack
- Key benefits
- Reduces design overhead
- Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channel (Wi-Fi networks)
- Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna
- Different provisioning methods for in-home devices connectivity to Wi-Fi in one step
- Lowest Wi-Fi power consumption in connected idle (< 800 µA)
- Configurable wake on WLAN filters to only wake up the system
- Wi-Fi and Bluetooth single antenna coexistence
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Processor | External MPU | Type | Module, Transceiver |
| Protocols | Wi-Fi 2.4 GHz, Wi-Fi 5 GHz | Throughput (max) (MBits) | 100 |
| Security | Networking security (WPA3) | Features | 2x2 MIMO, 802.11abgn, AP, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode |
| Certifications | CE, FCC, ISED, MIC | Operating temperature range (°C) | -40 to 85 |
| Rating | Catalog |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The WL1807MODGIMOCR chip is a highly integrated wireless communication module. It supports Wi-Fi, Bluetooth, and Bluetooth Low Energy (BLE) connectivity. It's commonly used in IoT devices, smart home applications, and industrial automation. With its compact design and versatile features, it provides reliable wireless connectivity for various applications.
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Equivalent
The WL1807MODGIMOCR chip's equivalent products include the WL1801MODGIMOCR, WL1831MODGIMOCR, and WL1835MODGIMOCR. They are all part of the same WiLink™ 8 family from Texas Instruments, offering similar features and functionalities for wireless connectivity in IoT and embedded systems. -
Features
WL1807MODGIMOCR is an integrated dual-band Wi-Fi and Bluetooth module that supports 2x2 MIMO technology and includes an additional on-chip processor for offloading some host CPU tasks. It also features support for Bluetooth Low Energy (BLE) v4.2 and Zigbee, as well as dual-mode wideband RF transceivers. -
Pinout
The WL1807MODGIMOCR is a wireless module with 180 pins. It integrates Wi-Fi, Bluetooth, and FM functionalities, suitable for embedded systems requiring wireless connectivity. The pin functions include power, communication interfaces, and antenna connections. -
Manufacturer
The WL1807MODGIMOCR is manufactured by Texas Instruments (TI), an American semiconductor company. TI specializes in designing and manufacturing semiconductors and integrated circuits for a wide range of applications, including analog and digital electronics, embedded systems, and wireless connectivity solutions like the WL1807MODGIMOCR. -
Application Field
The WL1807MODGIMOCR is primarily used in Internet of Things (IoT) applications, including smart homes, industrial automation, healthcare monitoring, and wearable devices. It enables wireless connectivity, location tracking, and communication capabilities in compact and power-efficient devices. -
Package
The WL1807MODGIMOCR chip comes in a BGA (Ball Grid Array) package type, with a form factor of module, and its size is approximately 6.5mm x 6.5mm.
Key points
-
The WL1807MODGIMOCR chip is a highly integrated wireless communication module. It supports Wi-Fi, Bluetooth, and Bluetooth Low Energy (BLE) connectivity. It's commonly used in IoT devices, smart home applications, and industrial automation. With its compact design and versatile features, it provides reliable wireless connectivity for various applications.
-
Equivalent
The WL1807MODGIMOCR chip's equivalent products include the WL1801MODGIMOCR, WL1831MODGIMOCR, and WL1835MODGIMOCR. They are all part of the same WiLink™ 8 family from Texas Instruments, offering similar features and functionalities for wireless connectivity in IoT and embedded systems. -
Features
WL1807MODGIMOCR is an integrated dual-band Wi-Fi and Bluetooth module that supports 2x2 MIMO technology and includes an additional on-chip processor for offloading some host CPU tasks. It also features support for Bluetooth Low Energy (BLE) v4.2 and Zigbee, as well as dual-mode wideband RF transceivers. -
Pinout
The WL1807MODGIMOCR is a wireless module with 180 pins. It integrates Wi-Fi, Bluetooth, and FM functionalities, suitable for embedded systems requiring wireless connectivity. The pin functions include power, communication interfaces, and antenna connections. -
Manufacturer
The WL1807MODGIMOCR is manufactured by Texas Instruments (TI), an American semiconductor company. TI specializes in designing and manufacturing semiconductors and integrated circuits for a wide range of applications, including analog and digital electronics, embedded systems, and wireless connectivity solutions like the WL1807MODGIMOCR. -
Application Field
The WL1807MODGIMOCR is primarily used in Internet of Things (IoT) applications, including smart homes, industrial automation, healthcare monitoring, and wearable devices. It enables wireless connectivity, location tracking, and communication capabilities in compact and power-efficient devices. -
Package
The WL1807MODGIMOCR chip comes in a BGA (Ball Grid Array) package type, with a form factor of module, and its size is approximately 6.5mm x 6.5mm.
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