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TI CC3100R11MRGCR

IC RF TxRx + MCU WiFi 802.11b/g/n 2.4GHz 64-VFQFN Exposed Pad

ISO14001 ISO9001 DUNS

Brands: Ti

Mfr.Part #: CC3100R11MRGCR

Datasheet: CC3100R11MRGCR Datasheet (PDF)

Package/Case: VQFN64

Product Type: RF Transceiver ICs

RoHS Status:

Stock Condition: 2500 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Please submit RFQ for CC3100R11MRGCR or email to us: Email: [email protected], we will contact you within 12 hours.

CC3100R11MRGCR General Description

Connect any low-cost, low-power microcontroller (MCU) to the Internet of Things (IoT). The CC3100 device is the industry’s first Wi-Fi CERTIFIED chip used in the wireless networking solution. The CC3100 device is part of the new SimpleLink Wi-Fi family that dramatically simplifies the implementation of Internet connectivity. The CC3100 device integrates all protocols for Wi-Fi and Internet, which greatly minimizes host MCU software requirements. With built-in security protocols, the CC3100 solution provides a robust and simple security experience. Additionally, the CC3100 device is a complete platform solution including various tools and software, sample applications, user and programming guides, reference designs and the TI E2E™ support community. The CC3100 device is available in an easy-to-layout QFN package.

The Wi-Fi network processor subsystem features a Wi-Fi Internet-on-a-Chip and contains an additional dedicated ARM MCU that completely offloads the host MCU. This subsystem includes an 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with 256-bit encryption. The CC3100 device supports Station, Access Point, and Wi-Fi Direct modes. The device also supports WPA2 personal and enterprise security and WPS 2.0. This subsystem includes embedded TCP/IP and TLS/SSL stacks, HTTP server, and multiple Internet protocols.

The power-management subsystem includes integrated DC-DC converters supporting a wide range of supply voltages. This subsystem enables low-power consumption modes, such as the hibernate with RTC mode requiringabout 4 µA of current.

The CC3100 device can connect to any 8, 16, or 32-bit MCU over the SPI or UART Interface. The device driver minimizes the host memory footprint requirements requiring less than 7KB of code memory and 700 B of RAM memory for a TCP client application.

CC3100R11MRGCR

Features

  • CC3100 SimpleLink Wi-Fi Consists of Wi-Fi
    Network Processor and Power-Management
    Subsystems
  • Wi-Fi CERTIFIED™ Chip
  • Wi-Fi Network Processor Subsystem
    • Featuring Wi-Fi Internet-On-a-Chip™
    • Dedicated ARM MCU
      Completely Offloads Wi-Fi and Internet
      Protocols from the External Microcontroller
    • Wi-Fi Driver and Multiple Internet Protocols in
      ROM
    • 802.11 b/g/n Radio, Baseband, and Medium
      Access Control (MAC), Wi-Fi Driver, and
      Supplicant
    • TCP/IP Stack
      • Industry-Standard BSD Socket Application
        Programming Interfaces (APIs)
      • 8 Simultaneous TCP or UDP Sockets
      • 2 Simultaneous TLS and SSL Sockets
    • Powerful Crypto Engine for Fast, Secure Wi-Fi
      and Internet Connections with 256-Bit AES
      Encryption for TLS and SSL Connections
    • Station, AP, and Wi-Fi Direct® Modes
    • WPA2 Personal and Enterprise Security
    • SimpleLink Connection Manager for
      Autonomous and Fast Wi-Fi Connections
    • SmartConfig™ Technology, AP Mode, and
      WPS2 for Easy and Flexible Wi-Fi Provisioning
    • TX Power
      • 18.0 dBm @ 1 DSSS
      • 14.5 dBm @ 54 OFDM
    • RX Sensitivity
      • –95.7 dBm @ 1 DSSS
      • –74.0 dBm @ 54 OFDM
    • Application Throughput
      • UDP: 16 Mbps
      • TCP: 13 Mbps
  • Host Interface
    • Interfaces with 8-, 16-, and 32-Bit MCU or
      ASICs Over SPI or UART Interface
    • Low External Host Driver Footprint: Less Than
      7KB of Code Memory and 700 B of RAM Memory
      Required for TCP Client Application
  • Power-Management Subsystem
    • Integrated DC-DC Supports a Wide Range of
      Supply Voltage:
      • VBAT Wide-Voltage Mode: 2.1 to 3.6 V
      • Preregulated 1.85-V Mode
    • Advanced Low-Power Modes
      • Hibernate with RTC: 4 µA
      • Low-Power Deep Sleep (LPDS): 115 µA
      • RX Traffic (MCU Active): 53 mA @
        54 OFDM
      • TX Traffic (MCU Active): 223 mA @
        54 OFDM, Maximum Power
      • Idle Connected: 690 µA @ DTIM = 1
  • Clock Source
    • 40.0-MHz Crystal with Internal Oscillator
    • 32.768-kHz Crystal or External RTC Clock
  • Package and Operating Temperature
    • 0.5-mm Pitch, 64-Pin, 9-mm × 9-mm QFN
    • Ambient Temperature Range: –40°C to 85°C
CC3100R11MRGCR

Specifications

Parameter Value Parameter Value
Processor External MCU Type Wireless network processor
Protocols Wi-Fi 2.4 GHz Throughput (max) (MBits) 16
Security Networking security (WPA2) Features 1 STA, 2 secure sockets, 802.11bgn, IPv4
Certifications Wi-Fi CERTIFIED Chip Operating temperature range (°C) -40 to 85
Rating Catalog

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

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Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The CC3100R11MRGCR chip is a Wi-Fi network processor designed for Internet of Things applications. It combines a high-performance ARM Cortex-M4 microcontroller with integrated Wi-Fi connectivity, allowing for easy and efficient connection to wireless networks. It provides secure and reliable communication for IoT devices, making it an ideal solution for a wide range of IoT applications.
  • Equivalent

    The equivalent products of CC3100R11MRGCR chip are CC3220S and CC3200, which are also wireless network processors with integrated Wi-Fi connectivity and IoT functionalities.
  • Features

    Features of CC3100R11MRGCR: 1. Complete Wi-Fi network processor 2. Supports low power consumption 3. Integrated TCP/IP stack 4. Easy integration with any microcontroller 5. Secure connections with built-in security protocols 6. Simple configuration with SmartConfig technology.
  • Pinout

    The CC3100R11MRGCR is a wireless network processor from Texas Instruments with a 64-pin QFN package. It includes features such as Wi-Fi connectivity, TCP/IP networking stack, and security protocols. Key functions include data communication, encryption, and authentication for IoT and embedded systems applications.
  • Manufacturer

    The manufacturer of the CC3100R11MRGCR is Texas Instruments. Texas Instruments is an American company that specializes in designing and manufacturing semiconductors and integrated circuits for a variety of industries, including consumer electronics, automotive, and industrial applications.
  • Application Field

    The CC3100R11MRGCR is commonly used in IoT applications such as home automation, smart energy, healthcare, and industrial automation. It is also suitable for applications requiring Wi-Fi connectivity in consumer electronics, such as smart thermostats, security systems, and wearable devices.
  • Package

    The CC3100R11MRGCR chip is a surface mount module package, in a form of a 14.2 mm x 15.5 mm Quad Flat No-Leads (QFN) package. It has a size of 5 mm x 5 mm x 1.2 mm.

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