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Orders Over
$5000
BGM113A256V2
Bluetooth Bluetooth v4.1 Transceiver Module 2.4GHz Integrated, Chip Surface Mount
Brands: Silicon Labs
Mfr.Part #: BGM113A256V2
Datasheet: BGM113A256V2 Datasheet (PDF)
Package/Case: 36-SMDModule
RoHS Status:
Stock Condition: 8,967 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $6.587 | $6.587 |
| 200 | $2.551 | $510.200 |
| 500 | $2.460 | $1230.000 |
| 1000 | $2.415 | $2415.000 |
In Stock: 8,967 PCS
BGM113A256V2 General Description
Bluetooth Modules - 802.15.1 BGM113 Wireless Bluetooth Module, PCB, +3 dBm, 2.4 GHz, 256 kB flash, -40 to 85 C, Built-in Antenna
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Series | Blue Gecko | Package | Strip |
| Product Status | Active | Programmabe | Not Verified |
| RF Family/Standard | Bluetooth | Protocol | Bluetooth v4.1 |
| Frequency | 2.4GHz | Data Rate | 1Mbps |
| Power - Output | 3dBm | Sensitivity | -93dBm |
| Serial Interfaces | SPI, UART | Antenna Type | Integrated, Chip |
| Utilized IC / Part | EFR32BG | Memory Size | 256kB Flash, 32kB RAM |
| Voltage - Supply | 3.8V | Current - Receiving | 8.7mA |
| Current - Transmitting | 8.8mA | Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C | Package / Case | 36-SMD Module |
| Base Product Number | BGM113 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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![Vacuum packaging]( "Vacuum packaging")
Step2 :Vacuum packaging
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![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
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![Individual packaging]( "Individual packaging")
Step4 :Individual packaging
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Step5 :Packaging boxes
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![bar-code shipping tag]( "bar-code shipping tag")
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The BGM113A256V2 is a versatile and high-performance Bluetooth Low Energy (BLE) chip from Silicon Labs. It features an ARM Cortex-M4 processor, 256 KB of flash memory, and a range of integrated peripherals. This chip is ideal for a wide range of IoT and wireless connectivity applications.
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Equivalent
The equivalent products of the BGM113A256V2 chip are Silicon Labs EFR32BG13, EFR32BG14, and EFR32BG1. These chips offer similar wireless connectivity features and are compatible with the same software development tools. -
Features
The BGM113A256V2 is a BLE module featuring an ARM Cortex-M4 processor, 256KB of flash memory, and 32KB of RAM. It has a built-in antenna, supports Bluetooth 5.2, and offers low energy consumption for long battery life in IoT applications. -
Pinout
The BGM113A256V2 is a Bluetooth 5.2 SoC with a 56-pin QFN package. It has 32 GPIO pins and supports a wide range of Bluetooth profiles and protocols, making it suitable for a variety of IoT applications. -
Manufacturer
The manufacturer of BGM113A256V2 is Silicon Labs. Silicon Labs is a leading provider of silicon, software, and solutions for a smarter, more connected world. They offer products and solutions for wireless, internet of things, industrial automation, automotive, and other industries. -
Application Field
BGM113A256V2 is commonly used in applications such as IoT, smart home devices, industrial sensors, wearables, and wireless communication modules. It is suitable for low power and low data rate applications that require Bluetooth connectivity. -
Package
The BGM113A256V2 chip is packaged in a QFN40 form factor which measures 6mm x 6mm. The chip has 256kB of flash memory and features Bluetooth Low Energy connectivity.
We provide high quality products, thoughtful service and after sale guarantee
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Minimum order quantity starts from 1pcs.
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365 days quality guarantee for all products
