Images are for reference only See Product Specifications
TI WL1835MODGBMOCR
Bluetooth, WiFi 802.11b/g/n, Bluetooth 4.2 Transceiver Module 2.4GHz Surface Mount
Brands: TI
Mfr.Part #: WL1835MODGBMOCR
Datasheet: WL1835MODGBMOCR Datasheet (PDF)
Package/Case: SMD
Product Type: RF Transceiver Modules
WL1835MODGBMOCR General Description
The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and Bluetooth® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.
Features
- General
- Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives, and power management
- Quick hardware design with TI module collateral and reference designs
- Operating temperature: –20°C to +70°C
- Small form factor: 13.3 × 13.4 × 2 mm
- 100-pin MOC package
- FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
- Wi-Fi
- WLAN baseband processor and RF transceiver support of IEEE Std 802.11b, 802.11g, and 802.11n
- 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
- 2.4-GHz MRC support for extended range
- Fully calibrated: production calibration not required
- 4-bit SDIO host interface support
- Wi-Fi direct concurrent operation (multichannel, multirole)
- Bluetooth and Bluetooth low energy (WL183xMOD only)
- Bluetooth 5.1 secure connection compliant and CSA2 support (declaration ID: D032799)
- Host controller interface (HCI) transport for Bluetooth over UART
- Dedicated audio processor support of SBC encoding + A2DP
- Dual-mode Bluetooth and Bluetooth low energy
- TI’s Bluetooth and Bluetooth low energy certified stack
- Key benefits
- Reduces design overhead
- Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channel (Wi-Fi networks)
- Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna
- Different provisioning methods for in-home devices connectivity to Wi-Fi in one step
- Lowest Wi-Fi power consumption in connected idle (< 800 µA)
- Configurable wake on WLAN filters to only wake up the system
- Wi-Fi and Bluetooth single antenna coexistence
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Processor | External MPU | Type | Module, Transceiver |
| Protocols | Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz | Throughput (max) (MBits) | 100 |
| Security | Networking security (WPA3) | Features | 2x2 MIMO, 802.11bgn, AP, Bluetooth, Bluetooth low energy, COEX, STA, Wi-Fi direct mode |
| Certifications | CE, FCC, ISED, MIC | Operating temperature range (°C) | -20 to 70 |
| Rating | Catalog |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
-
Step1 :Product
-
Step2 :Vacuum packaging
-
Step3 :Anti-static bag
-
Step4 :Individual packaging
-
Step5 :Packaging boxes
-
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
-
The WL1835MODGBMOCR chip is a wireless connectivity module developed by Texas Instruments. It is designed for embedded applications requiring Wi-Fi and Bluetooth connectivity. The chip integrates a Wi-Fi transceiver and a Bluetooth transceiver, enabling devices to communicate wirelessly with other devices or networks. It offers high-performance Wi-Fi and Bluetooth functionality in a compact form factor, making it ideal for various IoT and smart home applications.
-
Equivalent
There are no direct equivalent products of the WL1835MODGBMOCR chip. However, similar alternatives include the ESP32 and nRF52840, which offer similar functionalities and features for wireless communication and IoT applications. -
Features
The WL1835MODGBMOCR is a Wi-Fi and Bluetooth module by Texas Instruments. Its features include support for 2.4 and 5 GHz bands, Wi-Fi Direct and Soft AP modes, Bluetooth Low Energy (BLE) connectivity, and Bluetooth Classic support. It also offers integrated power management and enhanced security capabilities. -
Pinout
The pin count of the WL1835MODGBMOCR module is 88. It is a wireless network module that integrates Wi-Fi, Bluetooth, and Bluetooth Low Energy (BLE) functionalities. -
Manufacturer
The manufacturer of the WL1835MODGBMOCR is Texas Instruments. It is an American technology company that specializes in designing and manufacturing semiconductors and various integrated circuits. -
Application Field
The WL1835MODGBMOCR is a wireless connectivity module typically used in applications such as home automation, industrial automation, smart grids, healthcare, and asset tracking. It enables wireless communication over Bluetooth and Wi-Fi, making it suitable for various IoT devices requiring connectivity and data transfer capabilities. -
Package
The WL1835MODGBMOCR chip has a Ball Grid Array (BGA) package type, with a form factor of 7.5mm x 7.5mm.
Key points
-
The WL1835MODGBMOCR chip is a wireless connectivity module developed by Texas Instruments. It is designed for embedded applications requiring Wi-Fi and Bluetooth connectivity. The chip integrates a Wi-Fi transceiver and a Bluetooth transceiver, enabling devices to communicate wirelessly with other devices or networks. It offers high-performance Wi-Fi and Bluetooth functionality in a compact form factor, making it ideal for various IoT and smart home applications.
-
Equivalent
There are no direct equivalent products of the WL1835MODGBMOCR chip. However, similar alternatives include the ESP32 and nRF52840, which offer similar functionalities and features for wireless communication and IoT applications. -
Features
The WL1835MODGBMOCR is a Wi-Fi and Bluetooth module by Texas Instruments. Its features include support for 2.4 and 5 GHz bands, Wi-Fi Direct and Soft AP modes, Bluetooth Low Energy (BLE) connectivity, and Bluetooth Classic support. It also offers integrated power management and enhanced security capabilities. -
Pinout
The pin count of the WL1835MODGBMOCR module is 88. It is a wireless network module that integrates Wi-Fi, Bluetooth, and Bluetooth Low Energy (BLE) functionalities. -
Manufacturer
The manufacturer of the WL1835MODGBMOCR is Texas Instruments. It is an American technology company that specializes in designing and manufacturing semiconductors and various integrated circuits. -
Application Field
The WL1835MODGBMOCR is a wireless connectivity module typically used in applications such as home automation, industrial automation, smart grids, healthcare, and asset tracking. It enables wireless communication over Bluetooth and Wi-Fi, making it suitable for various IoT devices requiring connectivity and data transfer capabilities. -
Package
The WL1835MODGBMOCR chip has a Ball Grid Array (BGA) package type, with a form factor of 7.5mm x 7.5mm.
We provide high quality products, thoughtful service and after sale guarantee
-
We have rich products, can meet your various needs.
-
Minimum order quantity starts from 1pcs.
-
Lowest international shipping fee starts from $0.00
-
365 days quality guarantee for all products
