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Intel 10M25DAF256C8G
FPGA MAX 10 Family 25000 Cells 55nm Technology 1.2V 256-Pin FBGA Tray
Brands: Intel Corp
Mfr.Part #: 10M25DAF256C8G
Datasheet: 10M25DAF256C8G Datasheet (PDF)
Package/Case: 256-LBGA
Product Type: Programmable Logic ICs
10M25DAF256C8G General Description
MAX® 10 Field Programmable Gate Array (FPGA) IC 178 691200 25000 256-LBGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| feature-family-name | MAX 10 | feature-process-technology | 55nm |
| feature-maximum-number-of-user-i-os | 178 | feature-number-of-registers | |
| feature-device-logic-cells | 25000 | feature-device-system-gates | |
| feature-number-of-multipliers | 55 (18x18) | feature-program-memory-type | SRAM |
| feature-ram-bits-kbit | 675 | feature-total-number-of-block-ram | |
| feature-ethernet-macs | feature-supported-ip-core | ||
| feature-supported-ip-core-manufacture | feature-maximum-number-of-serdes-channels | ||
| feature-device-logic-units | 25000 | feature-device-number-of-dlls-plls | 4 |
| feature-transceiver-blocks | feature-transceiver-speed-gbps | ||
| feature-dedicated-dsp | 55 | feature-pci-blocks | |
| feature-programmability | Yes | feature-maximum-internal-frequency-mhz | |
| feature-speed-grade | 8 | feature-giga-multiply-accumulates-per-second | |
| feature-differential-i-o-standards-supported | HSUL|SSTL|LVDS | feature-single-ended-i-o-standards-supported | |
| feature-external-memory-interface | DDR3L SDRAM|DDR3 SDRAM|LPDDR2 SDRAM|DDR2 SDRAM | feature-minimum-operating-supply-voltage-v | 1.15 |
| feature-maximum-operating-supply-voltage-v | 1.25 | feature-packaging | Tray |
| feature-rohs | feature-rad-hard | ||
| feature-pin-count | 256 | feature-supplier-package | FBGA |
| feature-standard-package-name1 | BGA | feature-cecc-qualified | |
| feature-esd-protection | Yes | feature-escc-qualified | |
| feature-military | No | feature-aec-qualified | No |
| feature-aec-qualified-number | feature-auto-motive | No | |
| feature-p-pap | No | feature-eccn-code | EAR99 |
| feature-svhc | No |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The 10M25DAF256C8G chip is a high-performance field-programmable gate array (FPGA) developed by Xilinx. It offers a capacity of 2.5 million system gates and has 1,064 input/output pins. It operates at a maximum frequency of 550 MHz and is designed for a wide range of applications, including telecommunications, industrial automation, and image processing. It provides flexible and efficient programmable logic solutions for complex digital systems.
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Features
The features of 10M25DAF256C8G include an impressive 10 million system gates, a data width of 25 bits, and 256Kbytes of internal RAM. It also offers a C8G speed grade and is designed to be highly efficient and reliable. -
Pinout
The 10M25DAF256C8G is a Field Programmable Gate Array (FPGA) with a pin count of 256. The specific functions of each pin can vary depending on the configuration and programming of the FPGA. -
Manufacturer
The manufacturer of the 10M25DAF256C8G is Intel Corporation. Intel is a multinational technology company that designs and manufactures computer processors and related products for industries such as computing, data centers, and the Internet of Things. -
Application Field
The 10M25DAF256C8G FPGA can be used in a variety of applications, including aerospace and defense systems, industrial control and automation, automotive electronics, medical equipment, video and image processing, and telecommunications. -
Package
The package type of the 10M25DAF256C8G chip is C8G, the form is DA, and the size is 256.
Datasheet PDF
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