Xilinx XCV50BG256

Part points

• The XCV50BG256 chip is a type of field-programmable gate array (FPGA) produced by Xilinx. It has 50,000 logic cells and is housed in a 256-ball grid array (BGA) package. The chip is designed for high-performance applications such as digital signal processing, networking, and computer vision. It offers flexibility and can be reprogrammed to suit specific requirements.

• Equivalent

  The equivalent products of the XCV50BG256 chip are the XCV50E, XCV50P, and XCV50XL FPGA families from Xilinx, which offer similar capabilities and features in terms of the number of logic cells, speed, and package options.

• Features

  The XCV50BG256 is a field-programmable gate array (FPGA) with 50,000 logic cells and 256 pins. It offers a 1.5 to 3.3V supply voltage range and has a minimum operating frequency of 221 MHz. The FPGA supports numerous I/O standards, including single-ended and differential standards, making it suitable for various applications in the communication, industrial, and consumer markets.

• Pinout

  The XCV50BG256 is a Xilinx FPGA chip with a pin count of 256. It is used for digital logic design and has various functions, including configurable logic blocks, memory elements, and digital signal processing capabilities.

• Manufacturer

  The manufacturer of the XCV50BG256 is Xilinx. Xilinx is an American technology company known for designing, developing, and manufacturing programmable logic devices and associated technologies.

• Application Field

  The XCV50BG256 is a field-programmable gate array (FPGA) chip that can be used in various application areas, such as telecommunications, industrial automation, automotive electronics, and aerospace. It offers high performance and flexibility, allowing for custom functionality and rapid prototyping in these industries.

• Package

  The XCV50BG256 chip has a Ball Grid Array (BGA) package type. It is in the form of a surface-mounted integrated circuit (IC). The size of the chip is 17mm x 17mm.