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Xilinx XCF02S
FPGA - Configuration Memory Flash 2Mb PROM (ST Micro)
XCF02S General Description
XCF02S is a type of flash memory device manufactured by Xilinx. It belongs to the XCF family of products and is designed to be used in Xilinx FPGA (Field-Programmable Gate Array) systems for storing configuration data.
Features
- 2 Mb (megabit) density
- SPI (Serial Peripheral Interface) configuration interface
- Low-power CMOS technology
- High-reliability design with built-in error detection and correction
- RoHS-compliant and Pb-free
Application
- AT25SF041-SSHD-B (Adesto Technologies)
- S25FL128SAGMFI011 (Cypress Semiconductor)
- MX25L1605DM2I-12G (Macronix International)
- W25Q16FWSSIG (Winbond Electronics)
- M25P16-VMN6TP (Micron Technology)
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Manufacturer: | Xilinx | Product Category: | FPGA - Configuration Memory |
| Brand: | Xilinx | Product Type: | FPGA - Configuration Memory |
| Factory Pack Quantity: | 74 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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XCF02S is a non-volatile configuration memory device commonly used in FPGA programming. It offers a 2Mb capacity and fast programming speeds, making it ideal for storing configuration data in embedded systems. The XCF02S chip provides reliable performance and easy integration into various electronic designs.
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Equivalent
Some equivalent products of the XCF02S chip include the XCF04S, XCF08S, and XCF16S. These chips all offer similar features and functionality, providing customers with a range of options to suit their specific needs and requirements in terms of configuration memory devices. -
Features
XCF02S is a high-speed, low-power serial configuration device with a Advanced Sector Protection, low standby current and full read and program fast erase operations. It offers flexible 2x, 4x, and 8x I/O and multiple device ratio configurations. It also has an industry-standard 10-pin or 16-pin Surface Mount device package. -
Pinout
The XCF02S has a pin count of 8. It is a 2 Mb (256K x 8), 3.3V in-system programmable configuration PROM for CPLDs. The device offers cost-effective configuration for parallel NOR flash architectures. Please refer to the datasheet for more detailed information. -
Manufacturer
The XCF02S is manufactured by Xilinx, a leading American provider of programmable logic devices and software tools. Xilinx is a semiconductor company specializing in the development of field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs) for various industries such as telecommunications, automotive, aerospace, and consumer electronics. -
Application Field
The XCF02S is commonly used in applications such as automotive, telecommunications, industrial controls, medical devices, and military/aerospace systems. It is suitable for storing configuration data, firmware, and parameters in these industries due to its non-volatile memory, high reliability, and low power consumption. -
Package
The XCF02S chip is available in a 8-SOIC package type, with a surface mount form. It has a size of 3.90mm x 4.90mm and can be easily soldered onto a PCB for integration into electronic devices.
Datasheet PDF
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